Intel DG43RK LGA-775 socket DDR3 1333/1066 MHz 8GB BOXDG43RK Manuel D’Utilisation
Codes de produits
BOXDG43RK
Intel Desktop Board DG43RK Technical Product Specification
60
2.5.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots filled) must not exceed 8 A.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots filled) must not exceed 8 A.
2.6
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38
o
C at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 16) can reach a temperature of up to 85
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 16) can reach a temperature of up to 85
o
C in
an open chassis.