Texas Instruments TMS320C6726 Manuel D’Utilisation
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7
Mechanical Data
7.1 Package Thermal Resistance Characteristics
TMS320C6727, TMS320C6726, TMS320C6722
Floating-Point Digital Signal Processors
SPRS268E – MAY 2005 – REVISED JANUARY 2007
and
provide the thermal characteristics for the recommended package types used on
the TMS320C672x DSP.
Table 7-1. Thermal Characteristics for GDH/ZDH Package
AIR FLOW
NO.
°
C/W
(m/s)
Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB
1
R
θ
JA
Thermal Resistance Junction to Ambient
25
0
2
R
θ
JB
Thermal Resistance Junction to Board
14.5
0
3
R
θ
JC
Thermal Resistance Junction to Top of Case
10
0
4
Ψ
JB
Thermal Metric Junction to Board
14
0
5
Ψ
JT
Thermal Metric Junction to Top of Case
0.39
0
Table 7-2. Thermal Characteristics for RFP Package
THERMAL PAD CONFIGURATION
AIR
NO.
°
C/W
FLOW
VIA
TOP
BOTTOM
(m/s)
ARRAY
Two-Signal, Two-Plane, 76.2 x 76.2 mm PCB
(1) (2) (3)
1
R
θ
JA
Thermal Resistance Junction to Ambient
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
20
0
7.5 x 7.5 mm
7.5 x 7.5 mm
5 x 5
22
0
2
Ψ
JP
Thermal Metric Junction to Power Pad
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
0.39
0
Double-Sided 76.2 x 76.2 mm PCB
(1) (2) (4)
3
R
θ
JA
Thermal Resistance Junction to Ambient
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
49
0
10.6 x 10.6 mm
38.1 x 38.1 mm
6 x 6
27
0
10.6 x 10.6 mm
57.2 x 57 mm
6 x 6
22
0
10.6 x 10.6 mm
76.2 x 76.2 mm
6 x 6
20
0
4
Ψ
JP
Thermal Metric Junction to Power Pad
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
0.39
0
(1)
PCB modeled with 2 oz/ft
2
Top and Bottom Cu.
(2)
Package thermal pad must be properly soldered to top layer PCB thermal pad for both thermal and electrical performance. Thermal pad
is V
is V
SS
.
(3)
Top layer thermal pad is connected through via array to both bottom layer thermal pad and internal V
SS
plane.
(4)
Top layer thermal pad is connected through via array to bottom layer thermal pad.
Mechanical Data
107