HP Intel Xeon X5667 WG725AV Manuel D’Utilisation

Codes de produits

WG725AV

Intel

Xeon

Processor 5600 Series Datasheet Volume 1

7.2.3

On-Demand Mode ............................................................................... 133

7.2.4

PROCHOT# Signal ............................................................................... 133

7.2.5

THERMTRIP# Signal ............................................................................ 134

7.3

Platform Environment Control Interface (PECI) .................................................... 134
7.3.1

PECI Client Capabilities ........................................................................ 135

7.3.2

Client Command Suite ......................................................................... 136

7.3.3

Multi-Domain Commands ..................................................................... 155

7.3.4

Client Responses................................................................................. 155

7.3.5

Originator Responses........................................................................... 157

7.3.6

Temperature Data ............................................................................... 157

7.3.7

Client Management.............................................................................. 158

7.4

Storage Conditions Specifications....................................................................... 160

Features ................................................................................................................ 163
8.1

Power-On Configuration (POC)........................................................................... 163

8.2

Clock Control and Low Power States................................................................... 164
8.2.1

Thread and Core Power State Descriptions.............................................. 165

8.2.2

Package Power State Descriptions ......................................................... 166

8.2.3

Intel Xeon Processor 5600 Series C-State Power Specifications.................. 167

8.3

Sleep States ................................................................................................... 167

8.4

Intel

Turbo Boost Technology .......................................................................... 168

8.5

Enhanced Intel SpeedStep

Technology ............................................................. 168

Boxed Processor Specifications.............................................................................. 169
9.1

Introduction.................................................................................................... 169
9.1.1

Available Boxed Thermal Solution Configurations..................................... 169

9.1.2

Intel Thermal Solution STS100C

(Passive/Active Combination Heat Sink Solution) ..................................... 169

9.1.3

Intel Thermal Solution STS100A (Active Heat Sink Solution) ..................... 170

9.1.4

Intel Thermal Solution STS100P

(Boxed 25.5 mm Tall Passive Heat Sink Solution) .................................... 171

9.2

Mechanical Specifications.................................................................................. 171
9.2.1

Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ....... 172

9.2.2

Boxed Processor Retention Mechanism and Heat Sink

Support (URS) .................................................................................... 181

9.3

Fan Power Supply [STS100C (Combo) and STS100A (Active) Solutions].................. 182
9.3.1

Boxed Processor Cooling Requirements .................................................. 183

9.4

Boxed Processor Contents................................................................................. 185