Intel BOXDQ77KB Manuel D’Utilisation

Intel® Desktop Board DQ77KB

Technical

Executive Series

1 Intel® Turbo Boost Technology – maximum single-core turbo frequency (GHz). Intel
turbo Boost Technology requires a PC with a processor with Intel Turbo boost

Technology capability. Intel Turbo Boost Technology performance varies depending

on hardware,software, and overall system conﬁguration. Check with your PC

manufacturer on whether your system delivers Intel Turbo Boost Technology. See

www.intel.com/technology/tuboboost for more information

2 Intel® Hyper-Threading Technology requires a computer system with a processor

supporting HT Technology and an HT Technology-enabled chipset, BIOS, and

operating system. Performance will vary depending on the speciﬁc hardware and

software you use. See www.intel.com/info/hyperthreading for more information.

3 Intel® High Deﬁnition Audio requires a system with an appropriate Intel® chipset

and a motherboard with an appropriate codec and the necessary drivers installed.

System sound quality will vary depending on actual implementation, controller,

codec, drivers, and speakers. For more information about Intel® HD Audio, refer to

www.intel.com/design/chipsets/hdaudio.htm
4 64-bit computing on Intel® architecture requires a computer system with a

processor,chipset, BIOS, operating system, device drivers, and applications enabled

for Intel® 64 architecture. Processors will not operate (including 32-bit operation)

without an Intel 64 architecture-enabled BIOS. Performance will vary depending on

your hardware and software conﬁgurations. See http://developer.intel.com/tech

nology/intel64/index.htm for more information.

5 System resources and hardware (such as PCI and PCI Express*) require physical

memory address locations that can reduce available addressable system memory.

This could result in a reduction of as much as 1 GB or more of physical addressable

memory being available to the operating system and applications, depending on

the system conﬁguration and operating system.

6 WARNING: Altering PC memory frequency, voltage and/or latency may: (i) reduce

system stability and useful life of the system, memory and processor; (ii) cause the

processor and other system components to fail; (iii) cause reductions in system

performance; (iv) cause additional heat or other damage; and (v) affect system

data integrity. Intel has not tested, and does not warranty, the operation of the

memory beyond its speciﬁcations. Intel assumes no responsibility that the memory,

including if used with altered clock frequencies and/or voltages, will be ﬁt for any

particular

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®
PRODUCTS.NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL
ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIEDWARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining
applications.
Intel may make changes to speciﬁcations and product descriptions at any
time, without notice.

All products, dates, and ﬁgures speciﬁed are preliminary based on current expectations,
and are subject to change without notice. Availability in different channels may vary.

Actual Intel® Desktop Board may differ from the image shown.

Intel, the Intel logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation
in the U.S. and other countries.

* Other names and brands may be claimed as the property of others.

PROCESSOR

Processor Support

• Intel® Core™ i7 and Intel® Core™ i5 processors and other
• Intel® processors in the LGA1155 package.
• Supports Intel® 64 architecture

CHIPSET

• Intel® Q77 express chipset
• Intel® Q77 Platform Controller Hub (PCH)

PERIPHERAL CONNECTIVITY

• 4 SATA ports (2 SATA 6.0 Gb/s; 2 SATA 3.0 Gb/s)
• Dual Integrated 10/100/1000 Network Connection
• 4 Super-Speed USB 3.0 ports (4 back panel ports)
• 5 Hi-Speed USB 2.0 ports (5 internal headers)

SYSTEM BIOS

• 96 Mb Flash EEPROM with Intel® Platform Innovation
Framework for EFI Plug and Play
• Advanced conﬁguration and power interface V3.0b, SMBIOS 2.5
• Intel® Express BIOS update support

SYSTEM MEMORY

Memory capacity

• Two 204-pin SODIMM connectors supporting up to two double-sided
SODIMMs (16 GB max)

Memory Types

• DDR3 1600 / 1333 SDRAM memory support
• Non-ECC Memory

MEMORY MODES

• Dual- or single-channel operation support

MEMORY VOLTAGE

• 1.2 V to 1.8 V

HARDWARE MANAGEMENT FEATURES

• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management control

INTEL® PRO 10/100/1000 NETWORK CONNECTION

• Low-power design

EXPANSION CAPABILITIES

• One PCI Express* 3.0 x4 connector
• One Full-length PCI Express* Mini Card slot – supports mSATA
• One Half-length PCI Express* Mini Card slot – supports
wireless Intel® AMT

HEADERS

• One serial port header
• Custom Solutions header
• Digital microphone (DMIC) header
• Stereo speaker header

AUDIO

• Four-channel Intel® High Deﬁnition Audio ³ codec

JUMPERS AND FRONT-PANEL CONNECTORS

Jumpers

• Single conﬁguration jumper design
• Jumper access for BIOS maintenance mode

FRONT-PANEL CONNECTORS

• Reset, HDD LED, power LEDs, power on/off
• Front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header

MECHANICAL BOARD STYLE

• Thin Mini-ITX

BOARD SIZE

• 6.7” × 6.7” (17 cm × 17 cm)

BASEBOARD POWER REQUIREMENTS

• Thin Mini-ITX 19 V

ENVIRONMENT

OPERATING TEMPERATURE

• 0° C to +55° C

STORAGE TEMPERATURE

• -20°C to +70°C

REGULATIONS AND SAFETY STANDARDS

UNITED STATES AND CANADA

CSA / UL 60950-1, First Edition (Binational Standard)

EUROPE

(Low Voltage Directive 2006 / 95 / EC) EN 60950-1

INTERNATIONAL

IEC 60950-1

EMC REGULATIONS (tested in representative chassis)

united States

FCC 47 CFR Part 15, Subpart B

Canada

ICES-003 Class B

Europe

(EMC Directive 2004 / 108 / EC) EN 55022 and EN 55024

Australia / New Zealand

EN 55022 Class B

Japan

VCCI V-3, V-4 Class B

South Korea

KN-22 and KN-24

Taiwan

CNS 13438 Class B

International

CISPR 22 Class B

ENVIRONMENTAL COMPLIANCE EUROPE

Europe

Europe RoHS (Directive 2002/95/EC) china
China RoHS (MII Order # 39)