Intel DQ57TM Manuel D’Utilisation
Regulatory Compliance
81
Table 22. Lead-Free Second
Level Interconnect Marks
Description Mark
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the Desktop Board
substrate and the solder
connections from the board to
the components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the Desktop Board
substrate and the solder
connections from the board to
the components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
or
or
Restriction of Hazardous Substances (RoHS)
EU RoHS
EU RoHS Directive 2002/95/EC restricts the use of the following six materials in
various types of electronic and electrical equipment:
• Lead
• Mercury
• Cadmium
• Hexavalent chromium
• Polybrominated biphenyls (PBB)
• Polybrominated diphenyl ether (PBDE)
The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium,
which is limited to 0.01% or 100 ppm) by weight of homogeneous material.
various types of electronic and electrical equipment:
• Lead
• Mercury
• Cadmium
• Hexavalent chromium
• Polybrominated biphenyls (PBB)
• Polybrominated diphenyl ether (PBDE)
The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium,
which is limited to 0.01% or 100 ppm) by weight of homogeneous material.
Intel Desktop Board DQ57TM complies with these restrictions.