Siemens ERTEC200 Manuel D’Utilisation
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1.4 ERTEC 200 Package
The ERTEC 200 is supplied in an FBGA package with 304 pins. The distance between the pins is 0.8 mm. The
package dimensions are 19 mm x 19 mm.
package dimensions are 19 mm x 19 mm.
Figure 2: ERTEC 200 Package Description
Soldering instructions for the ERTEC 200 can be found in the following documents:
/10/
Soldering instructions for lead-based block.
/11/
Soldering instructions for lead-free block.
/12/
Code description for soldering.
When working with modules, always take precautionary measures against electrostatic charge
(ESD – Electrostatic Sensitive Devices).
Copyright © Siemens AG 2007. All rights reserved.
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ERTEC 200 Manual
Technical data subject to change Version 1.1.0