Intel Intel Core2 Extreme QX6850 HH80562XJ0808M Fiche De Données

Codes de produits
HH80562XJ0808M
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Thermal Specifications and Design Considerations
72
Datasheet
complete thermal solution designs target the Thermal Design Power (TDP) indicated in 
 instead of the maximum processor power consumption. The Thermal Monitor 
feature is designed to protect the processor in the unlikely event that an application 
exceeds the TDP recommendation for a sustained periods of time. For more details on 
In all cases the Thermal Monitor and 
Thermal Monitor 2 feature must be enabled for the processor to remain within 
specification.
Table 24.
Processor Thermal Specifications
Processor 
Numbers
Core 
Frequency 
(GHz)
Thermal 
Design 
Power (W)
Extended 
HALT Power 
(W)
1
NOTES:
1. Specification is at 50 °C T
C
 and typical voltage loadline.
Minimum 
T
C
 (°C)
Maximum T
C
 
(°C)
Notes
QX6800
2.93
130
50
5
See 
 
2, 3
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP
is not the maximum power that the processor can dissipate.
3. This table shows the maximum TDP for a given frequency range. Individual processors may have
a lower TDP. Therefore, the maximum T
C
 will vary depending on the TDP of the individual processor.
Please refer to thermal profile figure and associated table for the allowed combinations of power
and T
C
.