Intel Xeon 7130N LF80550KF0878M Fiche De Données
Codes de produits
LF80550KF0878M
Mechanical Specifications
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
37
3.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
experienced during heatsink removal.
3.5
Package Insertion Specifications
The Dual-Core Intel Xeon processor 7000 series can be inserted into and removed from a
mPGA604 socket 15 times. The socket should meet the mPGA604 requirements detailed in the
mPGA604 Socket Design Guidelines.
mPGA604 socket 15 times. The socket should meet the mPGA604 requirements detailed in the
mPGA604 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Dual-Core Intel Xeon processor 7000 series is 0.0784 lb [1.2544 oz]
(35.5616 g) to 0.0788 lb [1.2608 oz] (35.743 g). This mass [weight] includes all the components
that are included in the package.
(35.5616 g) to 0.0788 lb [1.2608 oz] (35.743 g). This mass [weight] includes all the components
that are included in the package.
3.7
Processor Materials
lists some of the package components and associated materials.
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N [80 lbf]
1,
2
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
Tensile
156 N [35 lbf]
3,
3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
Torque
8 N-m [70 lbf-in]
4,
4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber-Reinforced Resin
Substrate Pins
Gold Plated Copper