Intel i7-2960XM FF8062700834603 Manuel D’Utilisation

Datasheet

3

Introduction ..............................................................................................................9
1.1

Terminology ..................................................................................................... 10

Electrical Specifications ........................................................................................... 13
2.1

Intel

®

 QPI Differential Signaling .......................................................................... 13

Power and Ground Lands.................................................................................... 13

Decoupling Guidelines........................................................................................ 13
2.3.1

Processor Clocking (BCLK_DP, BCLK_DN) ............................................................. 14
2.4.1

Voltage Identification (VID) ................................................................................ 14

Reserved or Unused Signals................................................................................ 17

Signal Groups ................................................................................................... 18

Test Access Port (TAP) Connection....................................................................... 19

2.10 Absolute Maximum and Minimum Ratings ............................................................. 21
2.11 Processor DC Specifications ................................................................................ 22

2.11.1 DC Voltage and Current Specification ........................................................ 23
2.11.2 VCC Overshoot Specification .................................................................... 29
2.11.3 Die Voltage Validation ............................................................................. 30

Package Mechanical Specifications .......................................................................... 31
3.1

Land  Listing............................................................................................................. 37

Signal Descriptions.................................................................................................. 67

Thermal Specifications ............................................................................................ 71
6.1

Package Thermal Specifications........................................................................... 71
6.1.1

Thermal Specifications ............................................................................ 71

Thermal Metrology ................................................................................. 75