FN-LINK TECHNOLOGY LIMITED 6223E-UUD Manuel D’Utilisation
6223E-UUD
FN-LINK TECHNOLOGY LIMITED
1
Proprietary & Confidential Information
1. Introduction
6223E-UUD is a small size and low profile of WiFi + BT Combo module, board size is
12.2mm*13mm with module thickness of 1.7mm. It can be easily manufactured on
SMT process and highly suitable for tablet PC, ultra book, mobile device and
consumer products. It provides USB interface for WiFi and Bluetooth. The WiFi
throughput can go up to 150Mbps in theory by using 1x1 802.11n SISO technology
and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2.
12.2mm*13mm with module thickness of 1.7mm. It can be easily manufactured on
SMT process and highly suitable for tablet PC, ultra book, mobile device and
consumer products. It provides USB interface for WiFi and Bluetooth. The WiFi
throughput can go up to 150Mbps in theory by using 1x1 802.11n SISO technology
and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2.
6223E-UUD uses highly integrated WiFi/BT single chip based on advanced COMS
process. 6223E-UUD integrates whole WiFi/BT function blocks into a chip, such as
USB/PCM, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive
components remained on PCB.
process. 6223E-UUD integrates whole WiFi/BT function blocks into a chip, such as
USB/PCM, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive
components remained on PCB.
This compact module is a total solution for a combination of Wi-Fi + BT technologies.
The module is specifically developed for Smart phones and Portable devices.
The module is specifically developed for Smart phones and Portable devices.