Shenzhen Honeycomb Technologies Company Limited HRF24A13AN Manuel D’Utilisation
HRF24A13AN
©2013
Honeycomb Technologies Advance Information Page 11
Printed Circuit Board
The HRF24A13AN module printed circuit board is con-structed with FR4 material,
two layers and 0.8mm thick. The layers are shown in Figure 8 through Figure 9. The
stack up of the PCB is shown in Figure10
two layers and 0.8mm thick. The layers are shown in Figure 8 through Figure 9. The
stack up of the PCB is shown in Figure10
FIGURE 8 TOP COPPER
FIGURE 9 BOTTOM COPPER