Grid Connect Inc. BLE300SMTINT Manuel D’Utilisation
Description:
Features:
The low cost GC-BLE300-BGA Embedded BLE Module provides support for
Bluetooth 4.2 networking for a printed circuit board device design. The compact
module is a high performance feature rich surface mount (SMT) embedded
module. For optimal performance, the GC-BLE300-BGA has an internal PCB
antenna. (See the table on the reverse side for a summary of the GC-BLE300-
BGA ordering options.)
Based on the Marvell 88MB300 SoC, the GC-BLE300-BGA is a feature-rich
module that can provide Bluetooth support for an exisiting CPU or can host an
application on the module. Interface with the GC-BLE300-BGA via GPIOs or
high speed UART. Configure the device with Marvell’s BLE development toolkit
(contact Grid Connect for more information). The GC-BLE300-BGA can support
BLE, Bluetooth Classic and Bluetooth Audio.
With a small footprint, low cost, and a rich feature set, the GC-BLE300-BGA Em-
bedded WiFi Module is well suited for many applications. The module is small
enough to be added to handheld devices. With an industrial temperature range,
the GC-BLE300-BGA can be used in devices designed for harsh environments.
Multiple antenna options allow the GC-BLE300-BGA to be added to existing
device designs or to provide engineers with the design flexibility to meet specific
application requirements. The GC-BLE300-BGA is a member of a complete line
of Embedded Modules provided by Grid Connect. Need a smaller device size,
lower power, SPI interface? Grid Connect can help pick the best embedded
module to meet your needs.
Development is done via our GC-BLE300-BGA-EVK which brings out all the
pins and interfaces on the module to allow for quick development.
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Surface Mount BLE (Bluetooth
4.2) Embedded Module
•
Low cost and Compact Wireless
Networking Device (Size 13 x 18
mm)
•
Internal Chip Antenna
•
High Speed UART Data Interface
•
UART Interface is +1.8V
Compatible and Supports Free/
Auto Frame Function
•
BLE, Bluetooth Classic and Blue-
tooth Audio Protocols
•
Maximum of XX BLE Connections
•
128-bit AES-CCM Data Encyption
•
MCU available to run your custom
software
•
Mesh-capable (coming in 2016)
•
+1.8 - 4.2Vcc Power Supply (30
mA (peak)
•
Customizable via SDK
•
FCC/CE Certi ied
* SDK Required
1630 W. Diehl Road, Naperville, IL 60563
Phone: +1 (630) 245-1445
USA Toll Free: +1 (800) 975-4743
gridconnect.com
•
SMT BLE Module -
Industrial Temperature
(GC-BLE300-BGA)