Dynatron K618 88885166 Fascicule
Codes de produits
88885166
NEW PRODUCT SPEC SHEET
Dynatron K618 Thermal Performance
0.19
0.21
0.23
0.25
0.27
0.29
0.31
0.33
0.35
0
18
21
24
27
30
Wind Tunnel Airflow Rate (CFM)
T
h
e
rm
a
l Re
si
s
tan
ce
(
°c
/w
)
R-th
Model Number: K618
• Recommend for Intel® Xeon® Processor E3 Family, Socket LGA1155
Xeon® Processor 3000 Sequence, Socket LGA1156
• Passive Heat Sink for 2U Server
• Passive Heat Sink for 2U Server
Overall Specification:
• Dimension: 90.0 x 90.0 x 66.0mm
• Weight:
• Weight:
490g
• Copper Base with Aluminum Stacked Fin plus 3 Heat Pipes
• Back Strip is Included
• Thermal Grease Pre-Printed with GE-Toshiba TIG830SP
• Support CPU Power up to 95 Watts
• Back Strip is Included
• Thermal Grease Pre-Printed with GE-Toshiba TIG830SP
• Support CPU Power up to 95 Watts
Heatsink K618 Thermal Performance VS. Wind Tunnel Airflow :