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Intel
III Xeon 700 MHz
Manuel D’Utilisation
Intel III Xeon 700 MHz 80526KY7001M Manuel D’Utilisation
Codes de produits
80526KY7001M
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TABLE OF CONTENTS
2
TABLE OF CONTENTS
P
RODUCT
F
EATURES
............................................................................................................
I
1. INTRODUCTION ......................................................................................................................... 6
2. TERMINOLOGY .......................................................................................................................... 7
2.1 S.E.C. CARTRIDGE TERMINOLOGY.................................................................................... 7
2.2
S
TATE OF
D
ATA
................................................................................................................ 8
2.3
R
EFERENCES
.................................................................................................................... 8
3. ELECTRICAL SPECIFICATIONS ............................................................................................... 9
3.1
S
YSTEM
B
US AND
VREF................................................................................................... 9
3.2
P
OWER AND
G
ROUND
P
INS
............................................................................................... 9
3.3
D
ECOUPLING
G
UIDELINES
............................................................................................... 11
3.3.1 VCC_CORE ................................................................................................................... 11
3.3.2
LEVEL 2 CACHE DECOUPLING............................................................................. 11
3.3.3
SYSTEM BUS AGTL+ DECOUPLING..................................................................... 11
3.4
C
LOCK
F
REQUENCIES AND
S
YSTEM
B
US
C
LOCK
R
ATIOS
.................................................. 11
3.4.2
MIXING PROCESSORS OF DIFFERENT FREQUENCIES ................................... 13
3.5
V
OLTAGE
I
DENTIFICATION
................................................................................................ 13
3.6
S
YSTEM
B
US
U
NUSED
P
INS AND
T
EST
P
INS
..................................................................... 16
3.7
S
YSTEM
B
US
S
IGNAL
G
ROUPS
........................................................................................ 16
3.7.2
ASYNCHRONOUS VS. SYNCHRONOUS FOR SYSTEM BUS SIGNALS ............ 17
3.8
A
CCESS
P
ORT
(TAP) C
ONNECTION
................................................................................. 17
3.9
M
AXIMUM
R
ATINGS
......................................................................................................... 18
3.10
P
ROCESSOR
DC S
PECIFICATIONS
................................................................................... 18
3.11
AGTL+ S
YSTEM
B
US
S
PECIFICATIONS
............................................................................ 22
3.12
S
YSTEM
B
US
AC S
PECIFICATIONS
................................................................................... 24
4. SIGNAL QUALITY..................................................................................................................... 33
4.1 B
US
C
LOCK
S
IGNAL
Q
UALITY
S
PECIFICATIONS
......................................................................... 33
4.2
AGTL+ S
IGNAL
Q
UALITY
S
PECIFICATIONS
....................................................................... 34
4.2.2 AGTL+ Signal Quality Specifications .............................................................................. 34
4.2.3
AGTL+ OVERSHOOT/UNDERSHOOT GUIDELINES ............................................ 34
4.3 N
ON
-GTL+ S
IGNAL
Q
UALITY
S
PECIFICATIONS
.......................................................................... 37
4.3.1 2.5V Signal Overshoot/Undershoot Guidelines ............................................................. 38
4.3.2 BCLK Overshoot/Undershoot Guidelines and Specifications ........................................ 39
4.3.3 Measuring BCLK Overshoot/Undershoot........................................................................ 39
4.3.4 2.5V TOLERANT BUFFER RINGBACK SPECIFICATION ............................................ 40
4.3.5 2.5V TOLERANT BUFFER SETTLING LIMIT GUIDELINE............................................ 40
5. PROCESSOR FEATURES........................................................................................................ 41
5.1 L
OW
P
OWER
S
TATES AND
C
LOCK
C
ONTROL
............................................................................. 41
5.1.1
NORMAL STATE — STATE 1 ................................................................................. 41
5.1.2
AUTO HALT POWER DOWN STATE — STATE 2 ................................................. 41
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