Intel 1.40 GHz YA80543KC0174M Manuel D’Utilisation

Codes de produits

YA80543KC0174M

Datasheet

Contents

Introduction....................................................................................................................... 11

1.1

Overview ............................................................................................................. 11

1.2

Processor Abstraction Layer ............................................................................... 11

1.3

Mixing Processors of Different Frequencies and Cache Sizes ........................... 12

1.4

Terminology......................................................................................................... 12

1.5

State of Data ....................................................................................................... 12

1.6

Reference Documents......................................................................................... 13

Electrical Specifications.................................................................................................... 15

2.1

Itanium

2 Processor System Bus ...................................................................... 15

2.1.1

System Bus Power Pins ......................................................................... 15

2.1.2

System Bus No Connect ........................................................................ 15

2.2

System Bus Signals ............................................................................................ 15
2.2.1

Signal Groups......................................................................................... 15

2.2.2

Signal Descriptions................................................................................. 16

2.3

Package Specifications ....................................................................................... 17

2.4

Signal Specifications ........................................................................................... 18
2.4.1

Maximum Ratings................................................................................... 22

2.5

System Bus Signal Quality Specifications and Measurement Guidelines........... 23
2.5.1

Overshoot/Undershoot Magnitude ......................................................... 23

2.5.2

Overshoot/Undershoot Pulse Duration................................................... 24

2.5.3

Activity Factor......................................................................................... 24

2.5.4

Reading Overshoot/Undershoot Specification Tables............................ 25

2.5.5

Determining if a System Meets the Overshoot/Undershoot
Specifications ......................................................................................... 25

2.5.6

Wired-OR Signals................................................................................... 28

2.6

Power Pod Connector Signals ............................................................................ 30

2.7

Itanium

2 Processor System Bus Clock and Processor Clocking ..................... 32

2.8

Pinout Specifications ........................................................................................................ 37

Mechanical Specifications ................................................................................................ 69

4.1

Mechanical Dimensions ...................................................................................... 69

4.2

Package Marking................................................................................................. 72
4.2.1

Processor Top-Side Marking.................................................................. 72

4.2.2

Processor Bottom-Side Marking............................................................. 72

Thermal Specifications ..................................................................................................... 75

5.1

Thermal Features ................................................................................................ 75
5.1.1

Thermal Alert.......................................................................................... 75

5.1.2

Enhanced Thermal Management ........................................................... 76

5.1.3

Thermal Trip ........................................................................................... 76

5.2

Case Temperature .............................................................................................. 76

System Management Feature Specifications................................................................... 79

6.1

System Management Bus ................................................................................... 79
6.1.1

System Management Bus Interface ....................................................... 79

6.1.2

System Management Interface Signals.................................................. 79