Intel III Xeon 700 MHz 80526KY7002M Manuel D’Utilisation
Codes de produits
80526KY7002M
BOXED PROCESSOR SPECIFICATIONS
87
Figure 36. Boxed Processor Heatsink Performance
Figure 36 also shows the performance of the boxed processor heatsink with an attached auxiliary fan (50mm
X 50mm X 15mm). In this case, the temperature of the air entering the fan is used as T
AMBIENT
. T
AMBIENT
is
measured just outside the fan’s air intake. The presence of the auxiliary fan allows the cooling solution to
perform with very little local airflow. Therefore,
perform with very little local airflow. Therefore,
PA
is virtually constant and independent of the speed and
direction of airflow across the heatsink.
9.3.2 Optional auxiliary fan attachment
The boxed processor’s passive heatsink includes features that allow for attachment of an auxiliary fan to
improve airflow over the passive heatsink. A typical 40mm, 50mm, or 60mm fan can be attached. System
integrators must evaluate the thermal performance of their system (see above) and consider the baseboard
manufacturer’s recommendations for thermal management before deciding if an auxiliary fan is warranted. If
an auxiliary fan is needed (e.g. for the front processor in a multiprocessor system), it may be attached to the
face of the boxed processor’s passive heatsink. To facilitate this, the boxed processor’s passive heatsink will
include features in the heatsink fins onto which fan mounting hardware can be attached. The appropriate fan
attach hardware will be included with the boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz if
necessary. The boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz does not ship with an
auxiliary fan.
improve airflow over the passive heatsink. A typical 40mm, 50mm, or 60mm fan can be attached. System
integrators must evaluate the thermal performance of their system (see above) and consider the baseboard
manufacturer’s recommendations for thermal management before deciding if an auxiliary fan is warranted. If
an auxiliary fan is needed (e.g. for the front processor in a multiprocessor system), it may be attached to the
face of the boxed processor’s passive heatsink. To facilitate this, the boxed processor’s passive heatsink will
include features in the heatsink fins onto which fan mounting hardware can be attached. The appropriate fan
attach hardware will be included with the boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz if
necessary. The boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz does not ship with an
auxiliary fan.
Figure 37. Conceptual Views of the Boxed Processor with Attached 40mm and 50mm Auxiliary Fan
(fan not included with the Boxed Processor).
(fan not included with the Boxed Processor).
9.3.2.1 Clearance recommendations for auxiliary fan
If an auxiliary fan is used, clearance must be provided in front of the boxed processor passive heatsink to
accommodate the mechanical and airflow clearance requirements of the fan and mounting hardware.
Baseboard-mounted components and chassis members should not violate the clearance requirements for the
auxiliary fan. Figure 38 and Figure 39 show the clearance recommended for the fan and air inlet. Required
airspace clearance for fans may vary by manufacturer. Consult your fan manufacturer and/or fan
documentation for specifications.
accommodate the mechanical and airflow clearance requirements of the fan and mounting hardware.
Baseboard-mounted components and chassis members should not violate the clearance requirements for the
auxiliary fan. Figure 38 and Figure 39 show the clearance recommended for the fan and air inlet. Required
airspace clearance for fans may vary by manufacturer. Consult your fan manufacturer and/or fan
documentation for specifications.