Adtran XFP 10G 1310nm 1442910G1 Fascicule

Codes de produits
1442910G1
Page de 2
C A U T I O N 
C A U T I O N ! 
SUBJECT TO ELECTROSTATIC DAMAGE
OR DECREASE IN RELIABILITY.
HANDLING PRECAUTIONS REQUIRED.
For more information, refer to the Installation and Maintenance Practice (P/N 61442910G1-5) 
available online at 
Warranty
: ADTRAN will replace or repair this product within the warranty period if it does not 
meet its published specifications or fails while in service. Warranty information can 
be found online at
©2008 ADTRAN, Inc. All Rights Reserved.
PRICING AND AVAILABILITY  800.827.0807
TECHNICAL SUPPORT  800.726.8663
RETURN FOR REPAIR  256.963.8722
*61442910G1-22A*
P
ROVISIONING
The XFP is not directly provisionable. To provision 
the XFP, access the menu system of the host module. 
Refer to the “Provisioning” section of the Job Aid or 
Installation and Maintenance Practice provided with 
the host module for provisioning details.
C
OMPLIANCE
♦   
Electrostatic Discharge (ESD) can damage
electronic modules. When handling modules, wear
an antistatic discharge wrist strap to prevent
damage to electronic components. Place modules
in antistatic packing material when transporting
or storing. When working on modules, always
place them on an approved antistatic mat that is
electrically grounded.
♦  
The XFP meets or exceeds all the applicable
requirements of NEBS, Telcordia GR-63-CORE,
and GR-1089-CORE. The XFP is intended for
deployment in Central Office type facilities, EEEs,
EECs, and locations where the NEC applies (for
example, Customer Premises). The XFP is to be
installed in ADTRAN products in Restricted Access
Locations only, and installed by trained service
personnel.
This device complies with FCC 47 CFR Part 15, Class 
B. Operation is subject to the following two condi-
tions:
1. This device may not cause harmful interference.
2. This device must accept any interference 
received, including interference that may cause 
undesired operation.
Changes or modifications not expressly approved by 
ADTRAN could void the user's authority to operate 
this equipment.
♦  
Per GR-1089-CORE, the ADTRAN system in which
the SFP is being deployed is designed and intended
for installation as part of a Common Bonding
Network (CBN). The ADTRAN system in which the
SFP is being deployed is not designed nor intended
for installation as part of an Isolated Bonding
Network (IBN).
♦  
Per GR-1089-CORE Section 9, the XFP does not
have an internal DC connection between battery
return and frame ground. The XFP can be installed
in a DC-I (isolated) or DC-C (common) installation.
For installations where other cards or the host
system have internal connections between battery
return and frame ground, the system would be
i n t e n d e d   f o r   d e p l o y m e n t   o n l y   i n   a   D C - C
installation.
♦   
The ADTRAN system chassis frame ground
terminal must be connected to a reliable earth
ground to ensure that the metal enclosure of the
XFP is properly grounded via the backplane
connector.
The XFP is a Class 1 Laser Product and complies with
the Laser Safety requirements of  FDA 21CFR
1040.10 and 1040.11, and EN60825-1 and -2. The
XFP is NRTL listed and CB Certified to all applicable
American and European safety standards.
For continued compliance with the above laser safety
standards, only approved Class 1 modules from our
approved vendor list, located on the ADTRAN website,
should be installed in ADTRAN products.
NOTE
The Gigabit Ethernet port(s) are optical and therefore
are not classified as any type of port as defined in
Appendix B of GR-1089-CORE Issue 4.
The XFP is designed to meet the following environ-
mental classes:
ETSI EN 300 019-1-1 “Classification of 
environmental conditions; Storage,” Class 1.2
ETSI EN 300 019-1-2 “Classification of 
environmental conditions, Transportation,” Class 
2.3
ETSI EN 300 019-1-3 “Classification of 
environmental conditions, Stationary use at 
weather-protected locations,” Class 3.3
The equipment is designed to function without degra-
dation during exposure to all test severities per Class 
3.3.