Intel R1304GL4DS9 Fascicule
Maximum Memory
Capacity
24 or 16 DIMMs support up to
768GB of addressable memory
on 8 channels
768GB of addressable memory
on 8 channels
Exceptional Energy
Efficiency
Innovative Spread Core design
for best power efficiency and
performance
for best power efficiency and
performance
Extensive I/O Flexibility
Most expansion slots for I/O,
RAID ROC, or IOC modules
For more information on
Intel server solutions visit:
intelserveredge.com
For more information on Intel
server products visit:
intel.com/go/serverproducts
For product specifications
visit:
ark.intel.com
For regulatory information visit:
intel.com/support/motherboards/
server/sb/CS-032524.htm
Copyright © 2014 Intel Corporation. All rights reserved.
327583-003 US
0314 /GMcK/MANDISH/PDF
Intel® Server Board S2600GZ Product Family Technical Specifications
Form Factor
1U rack: 1.75” x 16.93” x 27.95”
2U rack: 3.44” x 16.93” x 27.95”
2U rack: 3.44” x 16.93” x 27.95”
Server Board Included
S2600GL4: 16 DIMMs
S2600GZ4: 24 DIMMs
S2600GZ4: 24 DIMMs
Processors Supported
2 Intel® Xeon® processor E5 2600 or E5 2600v2 product family, up to 135W
Up to 2 Intel® Xeon Phi™ coprocessors
1
Total Slots
8
Slot Types
2 PCI Express* 3.0 x8 personality modules
2 PCI Express 3.0 x24 superslots (6 PCI Express 3.0 x8 or 2 PCI Express
2 PCI Express 3.0 x24 superslots (6 PCI Express 3.0 x8 or 2 PCI Express
3.0 x16 + 2 PCI Express 3.0 x8)
Memory Capacity
16 or 24 LR / U / RDIMMs with up to 1866MT/s, ECC
512 or 768 GB max
512 or 768 GB max
Drive Options
1U rack: 8 x 2.5” or 4 x 3.5” hot-swap HDDs
2U rack: 8/16/24 x 2.5” or 8/12 x 3.5” hot-swap HDD + 2 fixed SSDs
2U rack: 8/16/24 x 2.5” or 8/12 x 3.5” hot-swap HDD + 2 fixed SSDs
System Cooling
Redundant cooling fans
Power Supply Options
460W AC Redundant PSU (Gold Efficiency), 750W AC Redundant PSU
(Platinum Efficiency)
Module Upgrades
Intel® I/O Module
Intel® Storage I/O Module
Intel® Remote Management Module 4
eUSB SSD
Internal type A USB
TPM Module
1U 2.5” or 3.5” Drives
R1208GL4DS
8 x 2.5” hotswap HDD
1 x 460W AC PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R1208GZ4GC
8 x 2.5” hot-swap HDD
2 x 750W AC PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R1208GZ4GS9
4 x 3.5” hot-swap HDD
1 x 750W AC PSU
R1304GL4DS9
4 x 3.5” hot-swap HDD
1 x 460W AC PSU
R1304GZ4GC
4 x 3.5” hot-swap HDD
2 x 750W AC PSU
Intel® RMM4 included
R1304GZ4GS9
4 x 3.5” hot-swap HDD
1 x 750W AC PSU
2U 2.5” Drives
R2208GL4GS
8 x 2.5” hot-swap HDD
1 x 750W AC PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R2208GZ4GC
8 x 2.5” hot-swap HDD
2 x 750W AC PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R2208GZ4GS9
8 x 2.5” hot-swap HDD
1 x 750W AC PSU
R2216GZ4GC
16 x 2.5” hot-swap HDD
2 x 750W AC PSU
Software RAID Key RKSAS8
Intel® RAID Expander
RES2CV240 24-port
Intel® RMM4 included
R2224GZ4GC4
24 x 2.5” hot-swap HDD
2 x 750W AC PSU
Intel® RMM4 included
2U 3.5” Drives
R2308GL4GS
8 x 3.5” hot-swap HDD
1 x 750W AC PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R2308GZ4GC
8 x 3.5” hot-swap HDD
2 x 750W AC PSU
Software RAID Key RKSATA8
Intel® RMM4 included
R2308GZ4GS9
8 x 3.5” hot-swap HDD
1 x 750W AC PSU
R2312GL4GS
12 x 3.5” hot-swap HDD
2 x 750W AC PSU
Intel® RMM4 included
R2312GZ4GC4
12 x 3.5” hot-swap HDD
2 x 750W AC PSU
Intel® RMM4 included
R2312GZ4GS9
12 x 3.5” hotswap HDD
1 x 750W AC PSU
1
Intel
®
Xeon Phi
™
coprocessor support depends on the board and chassis configuration. Passive cooled Intel Xeon Phi coprocessors for S2600GZ based systems require a custom air duct
sold as an accessory. See your sales representative for more details.
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ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
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IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts
Intel may make changes to specifications and product descriptions at any time, without notice. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts
or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. .
Intel, the Intel logo, Intel Inside, Intel Xeon Phi, Xeon and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Intel, the Intel logo, Intel Inside, Intel Xeon Phi, Xeon and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Product does not include memory, processors, or hard drives. For compatibility
information please refer to the configuration guide at
www.intel.com/support