Intel E3-1225 v3 BX80646E31225V3 Manuel D’Utilisation
Codes de produits
BX80646E31225V3
Figure 17.
Digital Thermal Sensor (DTS) Thermal Profile Definition
Table 19.
Thermal Margin Slope
PCG
Die
Configuration
(Native)
Core + GT
TDP (W)
TCC Activation
Temperature (°C)
MSR 1A2h 23:16
Temperature
Control Offset
MSR 1A2h 15:8
Thermal
Margin
Slope
(°C / W)
2013D
4+2 (4+2)
84
100
20
0.654
4+0 (4+2)
82
100
20
0.671
2013C
4+2 (4+2)
65
92
6
0.722
2+2 (2+2)
54
100
20
1.031
2+1 (2+2)
53
100
20
1.051
2013B
4+2 (4+2)
45
85
6
0.806
2013A
4+2 (4+2)
35
75
6
0.806
2+2 (4+2)
35
85
6
1.016
2+2 (2+2)
35
85
6
1.021
2+1 (2+2)
35
90
6
1.141
5.4
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Thermal Specifications
This section provides thermal specifications (Thermal Profile) and design guidelines for
enabled thermal solutions to cool the processor.
Thermal Management—Processor
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
June 2013
Datasheet – Volume 1 of 2
Order No.: 328907-001
67