Intel 2950M CW8064701487007 Manuel D’Utilisation

Codes de produits

CW8064701487007

Datasheet, Volume 1

2.3.3

DMI Link Down ...................................................................................... 32

2.4

Processor Graphics Controller (GT)...................................................................... 33
2.4.1

3D and Video Engines for Graphics Processing ........................................... 33
2.4.1.1

3D Engine Execution Units ......................................................... 33

2.4.1.2

3D Pipeline .............................................................................. 34

2.4.1.3

Video Engine ........................................................................... 34

2.4.1.4

2D Engine ............................................................................... 35

2.4.2

Processor Graphics Display...................................................................... 36
2.4.2.1

Display Planes.......................................................................... 36

2.4.2.2

Display Pipes ........................................................................... 37

2.4.2.3

Display Ports ........................................................................... 37

2.4.2.4

Embedded DisplayPort* (eDP*) .................................................. 37

2.4.3

Intel

Flexible Display Interface (Intel

FDI)............................................. 37

2.4.4

Multi Graphics Controllers Multi-Monitor Support ........................................ 38

2.5

Platform Environment Control Interface (PECI) ..................................................... 38

2.6

Interface Clocking............................................................................................. 38
2.6.1

Internal Clocking Requirements ............................................................... 38

Technologies........................................................................................................... 39
3.1

Intel

Virtualization Technology (Intel

VT) ......................................................... 39

3.1.1

Intel

Virtualization Technology (Intel

VT-x) Objectives ......................................................................... 39

3.1.2

Intel

Virtualization Technology (Intel

VT-x) Features ........................................................................... 40

3.1.3

Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Objectives ................................................................... 40

3.1.4

Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Features ...................................................................... 41

3.1.5

Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Features Not Supported................................................. 41

3.2

Intel

Trusted Execution Technology (Intel

TXT)................................................. 42

3.3

Intel

Hyper-Threading Technology (Intel

HT Technology) ................................... 42

3.4

Intel

Turbo Boost Technology ........................................................................... 43

3.4.1

Intel

Turbo Boost Technology Frequency.................................................. 43

3.4.2

Intel

Turbo Boost Technology Graphics Frequency.................................... 44

3.5

Intel

Advanced Vector Extensions (Intel

AVX)................................................... 44

3.6

Security and Cryptography Technologies .............................................................. 44
3.6.1

Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI) ....... 44

3.6.2

PCLMULQDQ Instruction ......................................................................... 45

3.6.3

RDRAND Instruction ............................................................................... 45

3.7

Intel

64 Architecture x2APIC ............................................................................ 45

3.8

Supervisor Mode Execution Protection (SMEP) ...................................................... 46

3.9

Power Aware Interrupt Routing (PAIR)................................................................. 47

Power Management ................................................................................................ 49
4.1

Advanced Configuration and Power Interface

(ACPI) States Supported.................................................................................... 50
4.1.1

System States....................................................................................... 50

4.1.2

Processor Core / Package Idle States........................................................ 50

4.1.3

Integrated Memory Controller States ........................................................ 50

4.1.4

PCI Express* Link States ........................................................................ 51

4.1.5

Direct Media Interface (DMI) States ......................................................... 51

4.1.6

Processor Graphics Controller States ........................................................ 51

4.1.7

Interface State Combinations .................................................................. 51

4.2

Processor Core Power Management ..................................................................... 52