Shuttle SZ77R5 Manuel D’Utilisation

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Product Specification
w w w . s h u t t l e . c o m  
 
Shuttle Computer Handels GmbH 
Fritz-Strassmann-Str. 5 
25337 Elmshorn | Germany
 
Tel. +49 (0) 4121-47 68 60 
Fax +49 (0) 4121-47 69 00 
sales@shuttle.eu
 
Page 2 |  5 April 2012
 
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Shuttle XPC Barebone SZ77R5 – Special Product Features 
 
The R5 chassis design: a clean and modern look 
R5 is the new chassis design for the middle / high-end series XPCs in 
the year 2012. Shuttle has always placed great emphasis on the 
interior and exterior aesthetics of the XPC, with the belief that a good 
blend of style and form factor allows the XPC to be attractive, versatile, 
and work well in almost any environment. The chassis and case cover 
are made of aluminium and come with a sleek brushed metal front 
fascia. The drives and front panel connectors are elegantly hidden by 
drive doors for superior style and visual appeal. 
 
  
21.6 cm
19.8 cm
33.2
 
Small, but easy to install 
Shuttle XPCs offer the performance of a desktop PC at a third of the 
size while using standard desktop components. Shuttle keeps the 
concept of being "futureproof" in mind when designing the new R5 
chassis. The meticulously designed internal layout features pre-routed 
cables to reduce clutter, increase airflow and make the installation of 
components easy. 
 
  
 
What is a Barebone? 
The Shuttle XPC Barebone SZ77R5 consists of a stylish case with pre-
installed mainboard, power supply unit (PSU) and cables. Despite its 
small form factor it offers outstanding connectivity, functionality and 
performance. For a full PC system, at least a processor, memory, hard 
disk and operating system need to be added. Shuttle XPC Barebones 
are completely customizable meaning users can pick certain 
components on their own to ideally match their individual needs. 
 
 
 
Traditional Planar 
Transistor 
22nm Tri-Gate 
Transistor 
 
Supports the Intel 22nm Ivy Bridge Processor 
Ivy Bridge (IVB) is the codename for Intel's new 22nm processor 
microarchitecture introduced in April 2012 along with the 7-series 
chipsets. Ivy Bridge is the first chip to use Intel's 22nm tri-gate 
transistors, which will help scale frequency and reduce power 
consumption. At a high level Ivy Bridge looks a lot like Sandy Bridge - 
one monolithic die incorporates up to four CPU cores, the shared L3 
cache, the memory controller, PCIe links and the graphics processor. 
Compared to its predecessor Sandy Bridge, the new design brings 
some improvements in overall performance, overclocking, power 
management and also features PCIe v3.0 and DDR3-1600 capability, 
an updated DirectX 11 graphics, new security features and CPU 
instructions. Ivy Bridge still uses the known LGA1155 socket - this allows 
cash conscious users to upgrade their XPC to SZ77R5 immediately and 
wait to upgrade their Sandy Bridge CPU later on in the year.