Intel E3-1271 v3 CM8064601575330 Manuel D’Utilisation

Codes de produits
CM8064601575330
Page de 116
Figure 17.
Digital Thermal Sensor (DTS) Thermal Profile Definition
Table 19.
Thermal Margin Slope
PCG
Die
Configuration
(Native)
Core + GT
TDP (W)
TCC Activation
Temperature (°C)
MSR 1A2h 23:16
Temperature
Control Offset
MSR 1A2h 15:8
Thermal
Margin
Slope
(°C / W)
2013D
4+2 (4+2)
84
100
20
0.654
4+0 (4+2)
82
100
20
0.671
2013C
4+2 (4+2)
65
92
6
0.722
2+2 (2+2)
54
100
20
1.031
2+1 (2+2)
53
100
20
1.051
2013B
4+2 (4+2)
45
85
6
0.806
2013A
4+2 (4+2)
35
75
6
0.806
2+2 (4+2)
35
85
6
1.016
2+2 (2+2)
35
85
6
1.021
2+1 (2+2)
35
90
6
1.141
5.4 
Intel
®
 Xeon
®
 Processor E3-1200 v3 Product Family
Thermal Specifications
This section provides thermal specifications (Thermal Profile) and design guidelines for
enabled thermal solutions to cool the processor.
Thermal Management—Processor
Intel
®
 Xeon
®
 Processor E3-1200 v3 Product Family
June 2013
Datasheet – Volume 1 of 2
Order No.: 328907-001
67