Intel BLKNUC5I3MYHE Manuel D’Utilisation

Intel® NUC NUC5i3MYHE/NUC5i3MYBE

TECHNIC AL SPECIFIC ATIONS

Look for Intel® NUC with Intel Inside® at

www.intel.com/NUC

Requires a system with Intel

Turbo Boost Technology. Intel Turbo Boost Tech-

nology and Intel Turbo Boost Technology 2.0 are only available on select Intel

processors. Consult your system manufacturer. Performance varies depending

on hardware, software, and system configuration. For more information, visit

http://www.intel.com/go/turbo

Requires an Intel

HD Audio enabled system. Consult your PC manufacturer

for more information. Sound quality will depend on equipment and actual

implementation. For more information about Intel HD Audio, refer to www.intel.

com/design/chipset/hdaudio.htm

64-bit computing on Intel

architecture requires a computer system with a

processor, chipset, BIOS, operating system, device drivers, and applications

enabled for Intel

64 architecture. Processors will not operate (including 32-bit

operation) without an Intel 64 architecture-enabled BIOS. Performance will vary

depending on your hardware and software configurations. Consult with your

system vendor for more information.

Copyright 2014 © Intel Corporation. All rights reserved. Intel, the Intel logo, Look Inside, the Look Inside logo, Intel Inside, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others.

Printed in USA

1214/BCP/HBD/PDF

Please Recycle

331447-001US

System resources and hardware (such as PCI and PCI Express*) require physi-

cal memory address locations that can reduce available addressable system

memory. This could result in a reduction of as much as 1 GB or more of physical

addressable memory being available to the operating system and applications,

depending on the system configuration and operating system.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH

INTEL

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY

THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDI-

TIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY

WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WAR-

RANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,

COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining

applications. Intel may make changes to specifications and product descriptions at

any time, without notice.
All products, dates, and figures specified are preliminary based on current

expectations, and are subject to change without notice. Availability in different

channels may vary.
Actual Intel

NUC kit may differ from the image shown.

PROCE SSOR

• 5th generation Intel® Core™ i3-5010U processor

(2.1 GHz Dual Core, 3 MB Cache, 15W TDP)

• Supports Intel® Virtualization Technology

(VT-x)

• Supports Intel® 64 architecture

G R A PHIC S

• Intel® HD Graphics 5500
• Two Mini DisplayPorts* version 1.2 each

supporting ultra-high definition 4K displays
and multiple monitor functionality

• One eDP connector (2-lane with backlight

and adjustable voltage/timings)

SYS TEM MEMORY

• Two DDR3L SO-DIMM sockets

(up to 16 GB, 1333/1600 MHz)

S TOR AG E C A PA B ILITIE S

• One M.2 Type B connector supporting 22x42

and 22x80 SATA or PCIe*

SSDs

• One SATA 6Gbps port for connection to

2.5" HDD or SSD (up to 9.5 mm thickness)

• Trusted Platform Module (TPM 2.0)

PER IPHER A L CONNEC TI V IT Y

• Integrated Intel® Gigabit LAN
• Two USB 3.0 port (front panel)
• Two USB 3.0 ports (back panel)
• Two USB 2.0 ports (internal header)
• One serial port (internal header) with back-

panel DB9 port option (3rd party cable)

SYS TEM B IOS

• Intel® Visual BIOS
• 64 Mb Flash EEPROM with Intel® Platform

Innovation Framework for EFI Plug and Play

• Advanced configuration and power interface

V3.0b, SMBIOS2.5

• Intel® Express BIOS update support
• Optimized POST for almost instant-on access

to PC from power on

H A R DWA R E M A N AG EMENT FE ATUR E S

• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management control
• Built-in watchdog timer support

E X PA NSION C A PA B ILITIE S

• One M.2 22x30 Type E connector (antennas

pre-assembled for wireless card support)

• One Custom Solutions header (DMIC, 3x

GPIO, 2x I2C, SMBus, 3.3/5 Vstby)

• One High-Speed Custom Solutions connector

(PCIe* x4)

• One NFC header

AUDIO

• Intel® HD Audio

via Mini DisplayPort version

1.2 supporting 8 channel digital audio
(7.1 surround sound)

• Intel HD Audio via front panel analog audio jack

(supporting headset, speakers, headphones,
microphone)

MECH A NIC A L CH A SSIS SIZE

• 4.53" x 4.37" x 1.9"
• 115 mm x 111 mm x 48.7 mm

BA SEBOA R D POWER R EQUIR EMENT S

• 12-24V DC internal power header
• 12-19V DC back panel power connector
• 19V, 65W wall-mount AC-DC power adapter
• Multi-country AC adapter

(IEC plug types A, C, G and I)

EN V IRONMENT OPER ATING
TEMPER ATUR E

• 0° C to +50° C

S TOR AG E TEMPER ATUR E

• -20° C to +70° C

PRODUC T SA FE T Y R EGUL ATIONS
A ND S TA NDA R DS

• IEC 60950-1
• UL 60950-1
• EN 60950-1
• CAN/CSA-C22.2 No. 60950-1

EMC R EGUL ATIONS A ND S TA NDA R DS
(CL A SS B)

• CISPR 22
• FCC CFR Title 47, Chapter I, Part 15,

Subparts A, B

• ICES-003
• EN 55022
• EN 55024
• VCCI V-3, V-4
• KN-22
• KN-24
• CNS 13438

EN V IRONMENTA L R EGUL ATIONS

• RoHS Directive 2011/65/EU
• WEEE Directive 2002/96/EC
• China RoHS MII Order #39