Intel 4 3.20 GHz BX80532PG3200F Manuel D’Utilisation
Codes de produits
BX80532PG3200F
78
Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
Boxed Processor Specifications
7.2
Mechanical Specifications
7.2.1
Boxed Processor Cooling Solution Dimensions
This section describes the mechanical specifications of the boxed Pentium 4 processor on
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.
shows a mechanical representation of the boxed Pentium 4 processor on 0.13 micron
process.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in
(Side Views), and
(Top View). The airspace requirements for
the boxed processor fan heatsink must also be incorporated into new motherboard and system
designs. Airspace requirements are shown in
and
. Note that some figures
have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
Figure 7-2. Side View Space Requirements for the Boxed Processor