Takamisawa JV-05S-KT PCB Mount Relay 5Vdc 1 NO, SPST-NO JV-05S-KT Fiche De Données

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  Relays produced after the specific date code that is indicated on each data sheet are lRoHS-compliant now.

 

Please refer to Lead-Free Status Info:

 

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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  Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. As of February 2005, Sn-3.0CuNi will be 

 

used for FTR-B3 and FTR-B4 series relays.

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  Relays that are RoHS compliant do not contain the hazardous materials that are restricted by the 

 

RoHS directive. Hazardous materials are cadmium, lead, mercury, chromium VI, PBB, PBDE 

 

including pentaBDE and octaBDE (with a concentration level <0.1%). 

 

Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)

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  It has been verified that using lead-free relays in leaded assembly processes will not cause any 

 

problems (compatible).

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“JEDEC STANDARD” and “LF” is marked on each outer and inner carton. (No marking on individual 

 

relays. Please refer to Lead Free Label Info). 

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  To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.  

 

 

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Recommended solder paste Sn-3.0Ag-0.5Cu.

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Moisture Sensitivity Level standard is not applicable to electromechanical realys.

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SnAgCu and SnCuNi solder have a low risk of tin whisker.  No considerable length whisker was found 

 

by our in-house tests.

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Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating 
is between the terminal and Sn plating to avoid whisker.

Pre-heating: 

maximum 120˚C

Soldering: 

dip within 5 sec. at  

 

 

260˚C soler bath

Soldering Iron 
Temperature: 

maximum 360˚C

Duration: 

maximum 3 sec.