Intel 2 Duo E8200 BX80570E8200 Fiche De Données
Codes de produits
BX80570E8200
Package Mechanical Specifications
38
Datasheet
3.0.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.0.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.0.7
Processor Materials
lists some of the package components and associated materials.
3.0.8
Processor Markings
shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 21.
Processor Materials
Component
Material
Integrated Heat Spreader
(IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 9.
Processor Top-Side Markings Example
ATPO
S/N
INTEL ©'06 E8500
Intel® Core®2 Duo
SLxxx [COO]
3.16GHZ/6M/1333/06
[FPO]
M
e
4