STMicroelectronics TRANSIL ARRAY UN ESDA6V1-5P6 SOT-666 STM ESDA6V1-5P6 Fiche De Données
Codes de produits
ESDA6V1-5P6
Package information
ESDAxxxP6
6/8
Figure 13.
SOT-666IP Footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 4.
SOT-666IP Dimensions
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.60
0.018
0.024
A3
0.08
0.18
0.003
0.007
b
0.17
0.34
0.007
0.013
b1
0.19
0.27
0.34
0.007 0.011 0.013
D
1.50
1.70
0.059
0.067
E
1.50
1.70
0.059
0.067
E1
1.10
1.30
0.043
0.051
e
0.50
0.020
L1
0.19
0.007
L2
0.10
0.30
0.004
0.012
L3
0.10
0.004
L4
0.60
0.024
D
b
L3
L1
L4
e
b1
E1
L2
E
A
A3
0.30
0.50
2.60
0.62
0.99
0.21
1.40
0.20