Microchip Technology MCP3901EV-MCU16 Manuel D’Utilisation

Page de 38
Bill Of Materials (BOM)
 2010 Microchip Technology Inc.
DS51845B-page 37
1
TP1
Wire Test Point 0.3" Length
Component Corporation PJ-202-30
1
U1
IC REG LDO 800MA 5.0V SOT-223 National Semiconductor  LM1117MP-5.0/NOPB
1
U2
IC PIC USB MCU FLASH 48KX16 
80TQFP
Microchip
PIC18F86J55-I/PT
1
U3
IC REG LDO 800MA 3.3V SOT-223 National 
Semiconductor
®
LM1117MP-3.3/NOPB
1
U4
IC ENERGY METER 24SSOP
Microchip Technology 
Inc.
MCP3901-I/SS
1
U5
IC SRAM 4MB ASYNC 44-TSOPII
ISSI, Integrated Silicon 
Solution Inc
IS61LV5128AL-10TLI
1
U6
IC DRVR/RCVR MLTCH RS232 
20TSSOP
Texas Instruments
SN75C3223PW
1
U8
2.7V Voltage Supervisor SOT-23-3
Microchip Technology 
Inc.
MCP130T-270I/TT
1
X1
CRYSTAL 48.0000MHZ 10PF SMD Abracon Corporation
ABM3B-48.000MHZ-10-1-U-T
1
X2
CRYSTAL 3.579545MHZ 
18PFFUND SMD
Abracon Corporation
ABLS-3.579545MHZ-B2-T
1
X3
CRYSTAL 7.3728MHZ 18PF FUND 
SMD
Abracon Corporation
ABLS-7.3728MHZ-B2-T
TABLE B-1:
BILL OF MATERIALS (CONTINUED)
Qty
Reference
Description
Manufacturer
Part Number
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The 
released BOM used in manufacturing uses all RoHS-compliant components.
TABLE B-2:
BILL OF MATERIALS — COMPONENTS NOT INSTALLED
Qty
Reference
Description
Manufacturer
Part Number
 
J4
DO NOT INSTALL
120-pin MINI EDGE CARD 
SOCKET
SAMTEC
MEC1-160-02-L-D-A
1
LCD1
DO NOT INSTALL
1
P9
DO NOT INSTALL
13
R1, R2, R3, 
R4 R6, R8, 
R9, R10, R17, 
R18, R25 
R29, R35
DO NOT INSTALL
1
U7
DO NOT INSTALL
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM 
used in manufacturing uses all RoHS-compliant components.