Freescale Semiconductor MPC830x PowerQUICC II Pro Processor Evaluation Kit MPC8309-KIT MPC8309-KIT Fiche De Données

Codes de produits

MPC8309-KIT

MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2

Freescale Semiconductor

Package and pin listings

22 Package and pin listings

This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see

Section 22.1, “Package

parameters for the MPC8309,”

and

Section 22.2, “Mechanical dimensions of the MPC8309 MAPBGA,”

for information on the MAPBGA.

22.1

Package parameters for the

MPC

8309

The package parameters are as provided in the following list.

Package outline

19 mm

× 19 mm

Package Type

MAPBGA

Interconnects

489

Pitch

0.80 mm

Module height (typical)

1.48 mm; Min = 1.31mm and Max 1.61mm

Solder Balls

96 Sn / 3.5 Ag / 0.5 Cu (VM package)

Ball diameter (typical)

0.40 mm

22.2

Mechanical dimensions of the MPC8309 MAPBGA

The following figure shows the mechanical dimensions and bottom surface nomenclature of the
MPC8309, 489-MAPBGA package.