Analog Devices AD9233 Evaluation Board AD9233-80EBZ AD9233-80EBZ Fiche De Données
Codes de produits
AD9233-80EBZ
AD9233
Rev. A | Page 42 of 44
OUTLINE DIMENSIONS
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
7.00
BSC SQ
1
48
12
13
37
36
24
25
4.25
4.10 SQ
3.95
4.10 SQ
3.95
0.50
0.40
0.30
0.40
0.30
0.30
0.23
0.18
0.23
0.18
0.50 BSC
12° MAX
0.20 REF
0.80 MAX
0.65 TYP
0.65 TYP
1.00
0.85
0.80
0.85
0.80
5.50
REF
0.05 MAX
0.02 NOM
0.02 NOM
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
SEATING
PLANE
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 71. 48-Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD9233BCPZ-125
–40°C to +85°C
48-Lead Lead Frame Chip Scale Package [LFSCP_VQ]
CP-48-3
AD9233BCPZRL7–125
–40°C to +85°C
48-Lead Lead Frame Chip Scale Package [LFSCP_VQ]
CP-48-3
AD9233BCPZ-105
–40°C to +85°C
48-Lead Lead Frame Chip Scale Package [LFSCP_VQ]
CP-48-3
AD9233BCPZRL7–105
–40°C to +85°C
48-Lead Lead Frame Chip Scale Package [LFSCP_VQ]
CP-48-3
AD9233BCPZ-80
–40°C to +85°C
48-Lead Lead Frame Chip Scale Package [LFSCP_VQ]
CP-48-3
AD9233BCPZRL7–80
–40°C to +85°C
48-Lead Lead Frame Chip Scale Package [LFSCP_VQ]
CP-48-3
AD9233-125EB
Evaluation
Board
AD9233-105EB
Evaluation
Board
AD9233-80EB
Evaluation
Board
1
It is required that the exposed paddle be soldered to the AGND plane to achieve the best electrical and thermal performance .
2
Z = Pb-free part.