Analog Devices AD9233 Evaluation Board AD9233-80EBZ AD9233-80EBZ Fiche De Données
Codes de produits
AD9233-80EBZ
AD9233
Rev. A | Page 8 of 44
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
ELECTRICAL
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to DRGND
−0.3 V to +3.9 V
AGND to DRGND
−0.3 V to +0.3 V
AVDD to DRVDD
−3.9 V to +2.0 V
D0 through D11 to DRGND
−0.3 V to DRVDD + 0.3 V
DCO to DRGND
−0.3 V to DRVDD + 0.3 V
OR to DRGND
−0.3 V to DRVDD + 0.3 V
CLK+ to AGND
−0.3 V to +3.9 V
CLK− to AGND
−0.3 V to +3.9 V
VIN+ to AGND
−0.3 V to AVDD + 1.3 V
VIN− to AGND
−0.3 V to AVDD + 1.3 V
VREF to AGND
−0.3 V to AVDD + 0.2 V
SENSE to AGND
−0.3 V to AVDD + 0.2 V
REFT to AGND
−0.3 V to AVDD + 0.2 V
REFB to AGND
−0.3 V to AVDD + 0.2 V
SDIO/DCS to DRGND
−0.3 V to DRVDD + 0.3 V
PDWN to AGND
−0.3 V to +3.9 V
CSB to AGND
−0.3 V to +3.9 V
SCLK/DFS to AGND
−0.3 V to +3.9 V
OEB to AGND
−0.3 V to +3.9 V
ENVIRONMENTAL
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +85°C
Lead Temperature
(Soldering 10 Sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
θ
JA
θ
JC
Unit
48-lead LFCSP (CP-48-3)
26.4
2.4
°C/W
Typical θ
JA
and θ
JC
are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes,
reduces the θ
metal traces, and through holes, ground, and power planes,
reduces the θ
JA
.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.