Atmel SAM4S-XPLD Atmel ATSAM4S-XPLD ATSAM4S-XPLD Fiche De Données
Codes de produits
ATSAM4S-XPLD
1098
SAM4S [DATASHEET]
11100E–ATARM–24-Jul-13
Figure 44-7. UBM Pad Installation
This package respects the recommendations of the NEMI User Group.
Edge Ball Center to Center
D1
2.8 BSC
E1
2.8 BSC
Package Edge Tolerance
aaa
0.03
Coplanarity (Whole Wafer)
ccc
0.075
Ball/Bump Offset (Package)
ddd
0.05
Ball/Bump Offset (Ball)
eee
0.015
Table 44-20. WLCSP Package Reference - Soldering Information (Substrate Level)
UBM Pad (Under Bump Metallurgy) (E)
200
μm
PBO2 Opening (j)
240
μm
Table 44-21. Device and 64-ball WLCSP Package Maximum Weight
SAM4S
TBD
mg
Table 44-22. 64-ball WLCSP Package Characteristics
Moisture Sensitivity Level
1
Table 44-23. 64-ball WLCSP Package Reference
JEDEC Drawing Reference
Not JEDEC
JESD97 Classification
e1
Table 44-19.
64-ball WLCSP Package Dimensions (in mm)
SYMBOL
COMMON DIMENSIONS
MIN.
NOM.
MAX.