On Semiconductor NCP5030 Evaluation Board NCP5030MTTXGEVB NCP5030MTTXGEVB NCP5030MTTXGEVB Fiche De Données

 (Note 1)

Power Supply Voltage (Note 2)

V

bat

7.0

V

Over Voltage Protection

V

out

6.5

V

ESD HBM

2.0

kV

ESD MM

200

V

Digital Input Voltage
Digital Input Current

CTRL

−0.3 < V

in

 < V

bat 

+ 0.3

1.0

V

mA

WDFN 3x4 Package

Power Dissipation @ T

A

 = +85°C (Note 5)

Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air

P

D

R

qJC

R

qJA

Internally Limited

6.0

W

°C/W

°C/W

Operating Ambient Temperature Range

T

A

−40 to +85

°C

Operating Junction Temperature Range

T

J

−40 to +125

°C

Maximum Junction Temperature

T

JMAX

+150

°C

Storage Temperature Range

T

stg

−65 to +150

°C

MSL

1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T

A

 = 25°C.

2. According to JEDEC standard JESD22−A108B

.

3. This device series contains ESD protection and passes the following tests

:

Human Body Model (HBM) "2.0 kV per JEDEC standard: JESD22−A114 for all pins

Machine Model (MM) "200 V per JEDEC standard: JESD22−A115 for all pins

4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.

5. The thermal shutdown set to 160

°

C (typical) avoids irreversible damage on the device due to power dissipation.

6. For the 12−Pin 3x4 WDFN Package, the R

qJA 

is highly dependent on the PCB heat−sink area. For example, R

qJA

 can be 57

°

C/W for a one

layer board and 43 for a four layer board.

7. Per IPC/JEDEC standard: J−STD−020A.