STMicroelectronics L6227 DMOS Evaluation Board EVAL6227PD EVAL6227PD Fiche De Données

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In most applications the power dissipation in the IC is the main factor that sets the maximum 
current that can be delivered by the device in a safe operating condition. Therefore, it has to 
be taken into account very carefully. Besides the available space on the PCB, the right 
package should be chosen considering the power dissipation. Heat sinking can be achieved 
using copper on the PCB with proper area and thickness. 

 show the 

junction to ambient thermal resistance values for the PowerSO36, PowerDIP24 and SO24 
packages. 

For instance, using a PowerSO package with a copper slug soldered on a 1.5 mm copper 
thickness FR4 board with a 6 cm

2

 dissipating footprint (copper thickness of 35 µm), the 

R

th j-amb

 is about 35 °C/W. 

 shows mounting methods for this package. Using 

a multilayer board with vias to a ground plane, thermal impedance can be reduced down to 
15 °C/W.

Slug soldered 

to PCB with 

dissipating area

 

Slug soldered 

to PCB with 

dissipating area  

plus ground layer

 

Slug soldered to PCB with 

dissipating area plus ground layer 

contacted through via holes

 



































 

 



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