STMicroelectronics L6227 DMOS Evaluation Board EVAL6227PD EVAL6227PD Fiche De Données

DocID9453 Rev 2

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R

th-j-pins

Maximum thermal resistance junction pins

19

15

-

C/W

R

th-j-case

Maximum thermal resistance junction case

-

-

2

C/W

R

th-j-amb1

Maximum thermal resistance junction ambient

(1)

44

52

-

C/W

R

th-j-amb1

Maximum thermal resistance junction ambient

(2)

-

-

36

C/W

R

th-j-amb1

Maximum thermal resistance junction ambient

(3)

-

-

16

C/W

R

th-j-amb2

Maximum thermal resistance junction ambient

(4)

59

78

63

C/W

1. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm

2

 (with a thickness 

of 35 µm).

2. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm

2

 (with a thickness 

of 35 µm).

3. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm

2 

(with a thickness 

of 35 µm), 16 via holes and a ground layer.

4. Mounted on a multilayer FR4 PCB without any heat sinking surface on the board.