Corsair 2GB Dominator DDR3 Memory Module TW3X2G2133C9DF Fascicule
Codes de produits
TW3X2G2133C9DF
www.corsair.com
The Dominator Series TW3X2G2133C9DF is a 2048MByte kit of DDR3 SDRAM DIMMs built using Corsair’s latest
high performance heat sink with Dual-path Heat Xchange (DHX) technology coupled with a Corsair Airflow Fan.
This part delivers outstanding performance in the latest generation of dual-channel DDR3-based motherboards. It
has been tested extensively in popular DDR3 motherboards to ensure compatibility and performance at its rated
speed. This memory has been verified to operate at 2133MHz at latencies of 9-9-9-24 at 2.0V VDIMM.
TW3X2G2133C9DF
Every part is tested in Corsair's factory at 2133MHz, but your actual results may vary depending on the overclocking margin of your CPU and motherboard. Newer motherboards may be
used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance. RAM used on the module may
change without notice. © June 2008 Corsair Memory, Inc.
used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance. RAM used on the module may
change without notice. © June 2008 Corsair Memory, Inc.
2048 Megabytes of DDR3 memory
Two matched CM3X1G2133C9D modules
DHX technology provides maximum cooling
Includes Airflow Fan for maximum thermal
transfer
100% tested at 2133MHz in NVIDIA-based
motherboards
Lifetime warranty
FEATURES
TEST SPECS
Each module pair is tested together at 2133MHz
Packaged together immediately following
system test
Tested together at 2133MHz, Vdimm = 2.0V,
at latency settings of 9-9-9-24 on NVIDIA
790i-based motherboards with a dual core CPU
Must use sockets DIMM A2 and B2 (”black
sockets”) to achieve this performance
SPD programmed at:
JEDEC standard 9-9-9-24 values at
1333MHz
Dual-path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink