Intel 4 662 HH80547PG1042MH Fiche De Données
Codes de produits
HH80547PG1042MH
Datasheet
101
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8.1.3
Boxed Processor Support and Retention Module (SRM)
The boxed processor TMA requires a SRM assembly to attach directly to the chassis base pan and
to secure the processor and TMA in the mainboard socket. The boxed processor TMA will ship
with the heatsink attach clip assembly, duct, and screws for attachment. The SRM must be supplied
by the chassis hardware vendor. See the Support and Retention Module (SRM) External Design
Requirements Document, Balanced Technology Extended (BTX) System Design Guide, and the
Intel
to secure the processor and TMA in the mainboard socket. The boxed processor TMA will ship
with the heatsink attach clip assembly, duct, and screws for attachment. The SRM must be supplied
by the chassis hardware vendor. See the Support and Retention Module (SRM) External Design
Requirements Document, Balanced Technology Extended (BTX) System Design Guide, and the
Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design
Guidelines for more detailed design information regarding the support and retention module.
8.2
Electrical Requirements
8.2.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the baseboard. The power
cable connector and pinout are shown in
shipped with the boxed processor to draw power from a power header on the baseboard. The power
cable connector and pinout are shown in
. Baseboards must provide a matched power
header to support the boxed processor.
contains specifications for the input and output
signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of
2 pulses per fan revolution. A baseboard pull-up resistor provides V
2 pulses per fan revolution. A baseboard pull-up resistor provides V
OH
to match the system board-
mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the
SENSE signal is not used, pin 3 of the connector should be tied to GND.
SENSE signal is not used, pin 3 of the connector should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4
th
pin of the connector
labeled as CONTROL. This signal must be an open-drain output to be compatible with the 4-wire
PWM fan specification.
PWM fan specification.
Figure 8-3. Assembly Stack Including the Support and Retention Module
Thermal Module Assembly
- Heatsink and Fan
- Clip
- Structural Duct
- Heatsink and Fan
- Clip
- Structural Duct
Motherboard
SRM
Chassis Pan