Intel 4 HT 631 80552PG0802M2M Fiche De Données

Intel

Codes de produits

80552PG0802M2M

Datasheet

3

Contents

Introduction

.......................................................................................................9

Terminology ..................................................................................................... 10
1.1.1

Processor Packaging Terminology ............................................................. 10

References ....................................................................................................... 11

Electrical Specifications

............................................................................... 13

Power and Ground Lands.................................................................................... 13

Decoupling Guidelines........................................................................................ 13
2.2.1

Decoupling ...................................................................................... 13

Decoupling ...................................................................................... 13

FSB Decoupling...................................................................................... 14

Voltage Identification ......................................................................................... 14

Reserved, Unused, and TESTHI Signals ................................................................ 16

Voltage and Current Specification ........................................................................ 17
2.5.1

Absolute Maximum and Minimum Ratings .................................................. 17

DC Voltage and Current Specification ........................................................ 18

Overshoot ....................................................................................... 21

Die Voltage Validation ............................................................................. 22

Signaling Specifications...................................................................................... 22
2.6.1

FSB Signal Groups.................................................................................. 23

GTL+ Asynchronous Signals..................................................................... 25

Processor DC Specifications ..................................................................... 25
2.6.3.1

GTL+ Front Side Bus Specifications ............................................. 28

Clock Specifications ........................................................................................... 29
2.7.1

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29

FSB Frequency Select Signals (BSEL[2:0])................................................. 30

Phase Lock Loop (PLL) and Filter .............................................................. 30

BCLK[1:0] Specifications ......................................................................... 32

Package Mechanical Specifications

.................................................................. 33

Package Mechanical Drawing............................................................................... 33

Processor Component Keep-Out Zones................................................................. 37

Package Loading Specifications ........................................................................... 37

Package Handling Guidelines............................................................................... 37

Package Insertion Specifications.......................................................................... 38

Processor Mass Specification............................................................................... 38

Processor Materials............................................................................................ 38

Processor Markings............................................................................................ 38

Processor Land Coordinates ................................................................................ 39

Land Listing and Signal Descriptions

............................................................... 41

Processor Land Assignments ............................................................................... 41

Alphabetical Signals Reference ............................................................................ 64

Thermal Specifications and Design Considerations

....................................... 75

Processor Thermal Specifications ......................................................................... 75
5.1.1

Thermal Specifications ............................................................................ 75

Thermal Metrology ................................................................................. 79

Processor Thermal Features ................................................................................ 79
5.2.1

Thermal Monitor..................................................................................... 79

Thermal Monitor 2 .................................................................................. 80

On-Demand Mode .................................................................................. 81

PROCHOT# Signal .................................................................................. 82