Intel i5-4300Y CL8064701558601 Fiche De Données

PECI

The Platform Environment Control Interface (PECI) is a one-wire interface that

provides a communication channel between Intel processor and chipset components

to external monitoring devices.

PL1, PL2

Power Limit 1 and Power Limit 2

PPD

Pre-charge Power-down

Processor

The 64-bit multi-core component (package)

Processor Core

The term “processor core” refers to Si die itself, which can contain multiple execution

cores. Each execution core has an instruction cache, data cache, and 256-KB L2

cache. All execution cores share the L3 cache.

Processor Graphics

Intel Processor Graphics

Rank

A unit of DRAM corresponding to four to eight devices in parallel, ignoring ECC. These

devices are usually, but not always, mounted on a single side of a SO-DIMM.

SCI

System Control Interrupt. SCI is used in the ACPI protocol.

SDP

Scenario Design Power

SF

Strips and Fans

SMM

System Management Mode

SMX

Safer Mode Extensions

Storage Conditions

A non-operational state. The processor may be installed in a platform, in a tray, or

loose. Processors may be sealed in packaging or exposed to free air. Under these

conditions, processor landings should not be connected to any supply voltages, have

any I/Os biased, or receive any clocks. Upon exposure to “free air” (that is, unsealed

packaging or a device removed from packaging material), the processor must be

handled in accordance with moisture sensitivity labeling (MSL) as indicated on the

packaging material.

SVID

Serial Voltage Identification

TAC

Thermal Averaging Constant

TAP

Test Access Point

T

CASE

The case temperature of the processor, measured at the geometric center of the top-

side of the TTV IHS.

TCC

Thermal Control Circuit

T

CONTROL

T

CONTROL

 is a static value that is below the TCC activation temperature and used as a

trigger point for fan speed control. When DTS > T

CONTROL

, the processor must comply

to the TTV thermal profile.

TDP

Thermal Design Power: Thermal solution should be designed to dissipate this target

power level. TDP is not the maximum power that the processor can dissipate.

TLB

Translation Look-aside Buffer

TTV

Thermal Test Vehicle. A mechanically equivalent package that contains a resistive

heater in the die to evaluate thermal solutions.

TM

Thermal Monitor. A power reduction feature designed to decrease temperature after

the processor has reached its maximum operating temperature.

V

CC

Processor core power supply

V

DDQ

DDR3L and LPDDR3 power supply.

VF

Vertex Fetch

VID

Voltage Identification

Mobile 4th Generation Intel

®

 Core

™

 Processor Family, Mobile Intel

®

 Pentium

®

 Processor Family, and Mobile Intel

®

 Celeron

®

Processor Family

July 2014

Datasheet – Volume 1 of 2

Order No.: 329001-007

15