Shuttle SP45H7 Manuel D’Utilisation
Product Specification
w w w . s h u t t l e . c o m
Shuttle Computer Handels GmbH
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25337 Elmshorn | Germany
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
Fax +49 (0) 4121-47 69 00
sales@shuttle.eu
Fax +49 (0) 4121-47 69 00
sales@shuttle.eu
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Page 2 | 1 December 2008
Shuttle XPC Barebone SP45H7 – Special Product Features
New H7 chassis with enhance expansion ability
The new H7 chassis dimensions have grown slightly in contrast to the
previous G-Series adding various of welcome improvements to the
Shuttle XPC Barebone SP45H7. The larger power supply fan of 5cm in
size helps to cut down on noise level even more also providing a better
thermal efficiency for the entire system. The rear side now features two
perforations for parallel port and/or PS/2 expansion. The front panel
sports an eSATA port for instant access to an external hard disk. With a
renewed mainboard layout, the SP45H7 is capable of running dual-slot
graphics cards and up to four memory modules with a max. capacity
of 16GB.
previous G-Series adding various of welcome improvements to the
Shuttle XPC Barebone SP45H7. The larger power supply fan of 5cm in
size helps to cut down on noise level even more also providing a better
thermal efficiency for the entire system. The rear side now features two
perforations for parallel port and/or PS/2 expansion. The front panel
sports an eSATA port for instant access to an external hard disk. With a
renewed mainboard layout, the SP45H7 is capable of running dual-slot
graphics cards and up to four memory modules with a max. capacity
of 16GB.
Supports Quadcore, 1600 MHz FSB and 45nm processors
This Shuttle product supports the Intel® Core™2 Duo and Intel®
Core™2 Quad processors with up to 1600 MHz front side bus and the
new power-saving 45nm technology. Multi core brings multi power!
Core™2 Quad processors with up to 1600 MHz front side bus and the
new power-saving 45nm technology. Multi core brings multi power!
Dynamic Overclocking Technology (D.O.C.) *)
This is the overclocking function in the BIOS Setup, which is designed to
detect the load balance of CPU while running programs, and to adjust
the best CPU frequency automatically. When the mainboard detects
CPU is running programs, it will speed up CPU automatically to make
the program run smoothly and faster. When the CPU is temporarily
suspending or staying in the low load balance, it will restore the default
settings instead.
detect the load balance of CPU while running programs, and to adjust
the best CPU frequency automatically. When the mainboard detects
CPU is running programs, it will speed up CPU automatically to make
the program run smoothly and faster. When the CPU is temporarily
suspending or staying in the low load balance, it will restore the default
settings instead.
Dynamic Energy Saving (D.E.S.)
The Dynamic Energy Saving (D.E.S.) technology helps to improve power
efficiency significantly and reduces heat inside the case. A special
chip monitors the CPU load by the CPU's Power State Indicator (PSI)
signal and switches on/off 3 out of 4 of the MOS power phases
depending on stress and load of the system. This hardware-based
technology helps to eliminate wasted energy. Lower power
consumption also means less noise from cooling systems as a
consequence.
efficiency significantly and reduces heat inside the case. A special
chip monitors the CPU load by the CPU's Power State Indicator (PSI)
signal and switches on/off 3 out of 4 of the MOS power phases
depending on stress and load of the system. This hardware-based
technology helps to eliminate wasted energy. Lower power
consumption also means less noise from cooling systems as a
consequence.
Integrated Cooling Engine (I.C.E.)
Shuttle's XPCs offer the power of a desktop PC in a form factor one-
third the size. In order to ensure proper airflow inside a smaller unit,
more advanced cooling technologies have been developed and
implemented in the Shuttle XPC. Shuttle's industry-leading I.C.E.
heatpipe technology delivers efficient cooling and is exceptionally
quiet.
third the size. In order to ensure proper airflow inside a smaller unit,
more advanced cooling technologies have been developed and
implemented in the Shuttle XPC. Shuttle's industry-leading I.C.E.
heatpipe technology delivers efficient cooling and is exceptionally
quiet.
PCI-Express V2.0 for high-performance graphics cards
The Shuttle XPC Barebone SP45H7 is equipped with one PCI-Express x16
Version 2.0 slot delivering a bandwidth of up to 16GB/s, twice the
speed of PCI-E 1.0, thus providing plenty of potential for the newest
graphics cards. It is downward compatible, allowing use for most of the
present graphics cards as well.
Version 2.0 slot delivering a bandwidth of up to 16GB/s, twice the
speed of PCI-E 1.0, thus providing plenty of potential for the newest
graphics cards. It is downward compatible, allowing use for most of the
present graphics cards as well.