FIC A360 Manuel D’Utilisation
Hardware Functional Overview
• UPGA-2 packaging technology for thin form factor notebook designs. Exposed die
enables more efficient heat dissipation.
• Low-Power GTL+ processor system bus interface. 64-bit data bus, 100-MHz operation.
• Integrated Intel Floating-Point Unit compatible with the IEEE Std 754
• Integrated thermal diode measuring processor temperature.
• Integrated thermal diode measuring processor temperature.
4.5 System Core Logic
The system core logic function of the notebook is implemented on the CPU module and
motherboard using the VIA S3 Savage IX AGPset. The VIA S3 Savage IX AGPset is
intended for the Pentium III processor platform and emerging 3D graphics/multimedia
applications. The VIA S3 Savage IX AGPset brings 100/133-MHz FSB (front-side bus),
ATA/33/66/100 HDD support in UDMA mode 2 & 4 and PC100/133 SDRAM performance
to entry-level Performance PCs.
motherboard using the VIA S3 Savage IX AGPset. The VIA S3 Savage IX AGPset is
intended for the Pentium III processor platform and emerging 3D graphics/multimedia
applications. The VIA S3 Savage IX AGPset brings 100/133-MHz FSB (front-side bus),
ATA/33/66/100 HDD support in UDMA mode 2 & 4 and PC100/133 SDRAM performance
to entry-level Performance PCs.
4.5.1 VIA TWISTER Features
The VIA TWISTER Host Bridge provides a Host-to-PCI bridge, optimized DRAM controller
and data path, and an Accelerated Graphics Port (AGP) interface. AGP is a high performance,
component-level interconnect targeted at 3D graphics applications and is based on a set of
performance enhancements to PCI.
The VIA TWISTER functions and capabilities include:
Define Integrated Solutions for Value PC Mobile Designs
• Integrated VIA Apollo Pro133 and S3® Savaged IX in a single chip
and data path, and an Accelerated Graphics Port (AGP) interface. AGP is a high performance,
component-level interconnect targeted at 3D graphics applications and is based on a set of
performance enhancements to PCI.
The VIA TWISTER functions and capabilities include:
Define Integrated Solutions for Value PC Mobile Designs
• Integrated VIA Apollo Pro133 and S3® Savaged IX in a single chip
• 64-bit Advanced Memory controller supporting PC100/PC133 SDRAM and VCM
• Combines with VIA VT82C686B PCI-LPC South Bridge for state-of-the-art power
management
High Performance CPU Interface
• Socket 370 support for Intel Pentium III, Celeron™ processors
• 66/100/133 MHz CPU Front Side Bus (FSB)
• Built-in Phase Lock Loop circuitry for optimal skew control within and between clocking
regions
• Five outstanding transactions (four In-Order Queue IOQ) plus one output latch)
• Dynamic deferred transaction support
Advanced High Performance DRAM Controller
• DRAM interface runs synchronous (66/66, 100/100, 133/133) mode or pseudo-
• DRAM interface runs synchronous (66/66, 100/100, 133/133) mode or pseudo-
synchronous (66/100, 100/66, 100/133, 133/100) mode with FSB
• Concurrent CPU, AGP, and PCI access
• Supports SDRAM and VCM SDRAM memory types
• Support 3 DIMMs or 6 banks for up to 1.5 GB of DRAM (256Mb DRAM technology)
• 64-bit data width
• Supports maximum 8-bank interleave (8 pages open simultaneously); banks are allocated
based on LRU
• SDRAM X-1-1-1-1-1-1-1 back-to-back accesses
FIC A360 Service Manual
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