Analog Devices AD604 Manuel D’Utilisation
AD604
Rev. E | Page 29 of 32
COMPLIANT TO JEDEC STANDARDS MO-150-AG
06
01
06
-A
24
13
12
1
8.50
8.20
7.90
8.20
7.90
8.20
7.80
7.40
7.80
7.40
5.60
5.30
5.00
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
0.22
COPLANARITY
0.10
1.85
1.75
1.65
1.75
1.65
0.25
0.09
0.09
0.95
0.75
0.55
0.75
0.55
8°
4°
0°
4°
0°
Figure 64. 24-Lead Shrink Small Outline Package [SSOP]
(RS-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD604AN
−40°C to +85°C
24-Lead Plastic Dual In-Line Package [PDIP]
N-24-1
−40°C to +85°C
24-Lead Plastic Dual In-Line Package [PDIP]
N-24-1
AD604AR
−40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD604AR-REEL
−40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
−40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD604ARZ-RL
−40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD604ARS
−40°C to +85°C
24-Lead Shrink Small Outline Package [SSOP]
RS-24
AD604ARS-REEL
−40°C to +85°C
24-Lead Shrink Small Outline Package [SSOP]
RS-24
AD604ARS-REEL7
−40°C to +85°C
24-Lead Shrink Small Outline Package [SSOP]
RS-24
−40°C to +85°C
24-Lead Shrink Small Outline Package [SSOP]
RS-24
AD604ARSZ-RL
−40°C to +85°C
24-Lead Shrink Small Outline Package [SSOP]
RS-24
AD604ARSZ-R7
−40°C to +85°C
24-Lead Shrink Small Outline Package [SSOP]
RS-24
AD604-EVALZ
Evaluation
Board
1
Z = RoHS Compliant Part.
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