Sun Microsystems SME5224AUPA-400 Manuel D’Utilisation

26

CAUTION: Handle a module by carefully holding it by its edges and by the large CPU heatsink. Do not
bump or handle the SRAM heatsinks because this action can cause unseen damage to the solder connections.
Always handle modules and other electronic devices in an ESD-controlled environment.

Temperature

Ambient

-40

–

90

°

C

Temperature ramp

Ambient

–

–

10

°

C/min.

Shock (shipping)

- single module package

Drop height on to any edge, corner, or side of
shipping box

–

–

21

inches

Shock(shipping)

- multi-module package

Drop height on to any edge, corner, or side of
shipping box

–

–

18

inches