Intel Xeon L5520 P4X-DPL5520-226-8M586 Manuel D’Utilisation

Codes de produits

P4X-DPL5520-226-8M586

Intel

Xeon

Processor 5500 Series Datasheet, Volume 1

Contents

Introduction ..............................................................................................................9
1.1

Terminology ..................................................................................................... 10

1.2

References ....................................................................................................... 12

Intel® Xeon® Processors 5500 Series Electrical Specifications ............................... 13
2.1

Processor Signaling ........................................................................................... 13
2.1.1

Intel QuickPath Interconnect.................................................................... 13

2.1.2

DDR3 Signal Groups ............................................................................... 13

2.1.3

Platform Environmental Control Interface (PECI) ........................................ 14

2.1.4

Processor Sideband Signals ..................................................................... 14

2.1.5

System Reference Clock .......................................................................... 14

2.1.6

Test Access Port (TAP) Signals ................................................................. 15

2.1.7

Power / Other Signals ............................................................................. 15

2.1.8

Reserved or Unused Signals..................................................................... 23

2.2

Signal Group Summary ...................................................................................... 23

2.3

Mixing Processors.............................................................................................. 25

2.4

Flexible Motherboard Guidelines (FMB) ................................................................. 26

2.5

Absolute Maximum and Minimum Ratings ............................................................. 26

2.6

Processor DC Specifications ................................................................................ 28
2.6.1

VCC Overshoot Specifications................................................................... 31

2.6.2

Die Voltage Validation ............................................................................. 32

Package Mechanical Specifications .......................................................................... 43
3.1

Package Mechanical Specifications ....................................................................... 43
3.1.1

Package Mechanical Drawing.................................................................... 44

3.1.2

Processor Component Keep-Out Zones...................................................... 47

3.1.3

Package Loading Specifications ................................................................ 47

3.1.4

Package Handling Guidelines.................................................................... 47

3.1.5

Package Insertion Specifications............................................................... 47

3.1.6

Processor Mass Specification.................................................................... 48

3.1.7

Processor Materials................................................................................. 48

3.1.8

Processor Markings................................................................................. 48

3.1.9

Processor Land Coordinates ..................................................................... 48

Land Listing............................................................................................................. 49
4.1

Intel® Xeon® Processors 5500 Series Pin Assignments .......................................... 49
4.1.1

Land Listing by Land Name...................................................................... 49

4.1.2

Land Listing by Land Number ................................................................... 67

Signal Definitions .................................................................................................... 85
5.1

Signal Definitions .............................................................................................. 85

Thermal Specifications ............................................................................................ 89
6.1

Package Thermal Specifications........................................................................... 89
6.1.1

Thermal Specifications ............................................................................ 89

6.1.2

Thermal Metrology ............................................................................... 103

6.2

Processor Thermal Features .............................................................................. 104
6.2.1

Processor Temperature ......................................................................... 104

6.2.2

Adaptive Thermal Monitor...................................................................... 104

6.2.3

On-Demand Mode ................................................................................ 106

6.2.4

PROCHOT# Signal ................................................................................ 106

6.2.5

THERMTRIP# Signal ............................................................................. 107

6.3

Platform Environment Control Interface (PECI).................................................... 107
6.3.1

PECI Client Capabilities ......................................................................... 108

6.3.2

Client Command Suite .......................................................................... 109