Intel DX58SO, 10-Pack BLKDX58SO?KIT Manuel D’Utilisation

Codes de produits
BLKDX58SO?KIT
Page de 4
Ordering Information: See the Intel Web site at www.intel.com.  
For the most current product information, visit developer.intel.com/design/motherbd/
1
 Warning: altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system 
components to fail; (iii) cause  reductions in system performance; (iv) cause additional damage; and (v) affect system data integrity. Intel has not tested, and does not  
warranty, the operation of the processor beyond its specifications.
2
 Expected to be shipping in Q1 2009. Entertainment Software Rating Board (ESRB) rated M for Mature.
3
 Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on 
hardware, software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.
com/technology/turboboost for more information.
4
 Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating 
system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, 
see www.intel.com/info/hyperthreading
5
 System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This 
could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system 
configuration and operating system.
6
 Maximum peak memory bandwidth requires three DDR3 modules to be populated in each of the blue memory slots. DDR3 1600 memory support on this motherboard 
requires advanced knowledge of BIOS and memory tuning; individual results may vary. For specific supported memory for this motherboard, please visit www.intel.com/
products/motherboard/ for more details.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, 
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS 
PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, 
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUD-
ING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT 
OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to 
specifications and product descriptions at any time, without notice. All products and dates specified are preliminary based on 
current expectations and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image on the box.
Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2008 Intel Corporation. All rights reserved. 1208/AC/MS/PDF 
320960-001US
Technical Specifications
Power 
Baseboard Power Requirements 
•  ATX12V
Environment
 
Operating Temperature 
•  0° C to +55° C 
Storage Temperature 
•  -20° C to +70° C
Regulations and Safety Standards 
United States and Canada 
  UL 1950, Third edition—CAN/CSA C22.2 
  No. 950-95 with recognized U.S. and Canadian 
  component marks 
Europe 
  Nemko certified to EN 60950 International 
  Nemko certified to IEC 60950  
  (CB report with CB certificate)
EMC regulations  
(tested in representative chassis) 
United States 
  FCC Part 15, Class B  
  FCC Part 15, Class B open-chassis (cover off) 
  testing  
Canada 
  ICES-003, Class B
 
Europe  
  EMC directive 89/336/EEC; EN 55022:1998 
  Class B; EN 55024:1998 
Australia/New Zealand 
  AS/NZS 3548, Class B 
Taiwan 
  CNS 13438, Class B International 
  CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF  
via EN55022 +6 db in system configurations with  
an open chassis and EU Directive 89/336/EEC  
and use via EN55022 and EN50082-1 in a  
representative chassis.
Lead-Free: The symbol is used to 
identify electrical and electronic  
assemblies and components in which 
the lead (Pb) concentration level in  
any of the raw materials and the end product is  
not greater than 0.1% by weight (1000 ppm). This 
symbol is also used to indicate conformance to 
lead-free requirements and definitions adopted 
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.