Manuel D’Utilisation (SDA3100BABOX)Table des matières1 Overview131.1 QuantiSpeed™ Architecture Summary142 Interface Signals172.1 Overview172.2 Signaling Technology172.3 Push-Pull (PP) Drivers182.4 AMD Athlon™ System Bus Signals183 Logic Symbol Diagram194 Power Management214.1 Power Management States214.2 Connect and Disconnect Protocol244.3 Clock Control305 CPUID Support316 333 FSB AMD Sempron™ Processor Model 10 Specifications336.1 Electrical and Thermal Specifications for the 333 FSB AMD Sempron™ Processor Model 10336.2 333 FSB AMD Sempron™ Processor Model 10 SYSCLK and SYSCLK# AC Characteristics346.3 333 FSB AMD Athlon™ System Bus AC Characteristics356.4 333 FSB AMD Athlon™ System Bus DC Characteristics367 Electrical Data377.1 Conventions377.2 Interface Signal Groupings377.3 Voltage Identification (VID[4:0])387.4 Frequency Identification (FID[3:0])397.5 VCCA AC and DC Characteristics397.6 Decoupling397.7 VCC_CORE Characteristics407.8 Absolute Ratings427.9 SYSCLK and SYSCLK# DC Characteristics437.10 General AC and DC Characteristics447.11 Open Drain Test Circuit467.12 Thermal Diode Characteristics477.13 APIC Pins AC and DC Characteristics498 Signal and Power-Up Requirements518.1 Power-Up Requirements518.2 Processor Warm Reset Requirements549 Mechanical Data559.1 Die Loading559.2 AMD Sempron™ Processor Model 10 Part Number 27488 OPGA Package Dimensions569.3 AMD Sempron™ Processor Model 10 Part Number 27493 OPGA Package Dimensions5810 Pin Descriptions6110.1 Pin Diagram and Pin Name Abbreviations6110.2 Pin List7110.3 Detailed Pin Descriptions8011 Ordering Information89Taille: 3,6 MoPages: 102Language: EnglishOuvrir le manuel
Manuel D’Utilisation (SDA3100BI/BABOX)Table des matières1 Overview131.1 QuantiSpeed™ Architecture Summary142 Interface Signals172.1 Overview172.2 Signaling Technology172.3 Push-Pull (PP) Drivers182.4 AMD Athlon™ System Bus Signals183 Logic Symbol Diagram194 Power Management214.1 Power Management States214.2 Connect and Disconnect Protocol244.3 Clock Control305 CPUID Support316 333 FSB AMD Sempron™ Processor Model 10 Specifications336.1 Electrical and Thermal Specifications for the 333 FSB AMD Sempron™ Processor Model 10336.2 333 FSB AMD Sempron™ Processor Model 10 SYSCLK and SYSCLK# AC Characteristics346.3 333 FSB AMD Athlon™ System Bus AC Characteristics356.4 333 FSB AMD Athlon™ System Bus DC Characteristics367 Electrical Data377.1 Conventions377.2 Interface Signal Groupings377.3 Voltage Identification (VID[4:0])387.4 Frequency Identification (FID[3:0])397.5 VCCA AC and DC Characteristics397.6 Decoupling397.7 VCC_CORE Characteristics407.8 Absolute Ratings427.9 SYSCLK and SYSCLK# DC Characteristics437.10 General AC and DC Characteristics447.11 Open Drain Test Circuit467.12 Thermal Diode Characteristics477.13 APIC Pins AC and DC Characteristics498 Signal and Power-Up Requirements518.1 Power-Up Requirements518.2 Processor Warm Reset Requirements549 Mechanical Data559.1 Die Loading559.2 AMD Sempron™ Processor Model 10 Part Number 27488 OPGA Package Dimensions569.3 AMD Sempron™ Processor Model 10 Part Number 27493 OPGA Package Dimensions5810 Pin Descriptions6110.1 Pin Diagram and Pin Name Abbreviations6110.2 Pin List7110.3 Detailed Pin Descriptions8011 Ordering Information89Taille: 3,6 MoPages: 102Language: EnglishOuvrir le manuel
