Manuel D’Utilisation (HMT31GR7BFR8C-H9)Table des matièresDescription3Features3Ordering Information3Key Parameters4Speed Grade4Address Table4Pin Descriptions5Input/Output Functional Descriptions6Pin Assignments8Registering Clock Driver Specifications10Capacitance Values10Input & Output Timing Requirements10On DIMM Thermal Sensor11Connection of Thermal Sensor11Temperature-to-Digital Conversion Performance11Functional Block Diagram122GB, 256Mx72 Module(1Rank of x8)124GB, 512Mx72 Module(2Rank of x8) - page1134GB, 512Mx72 Module(2Rank of x8) - page2144GB, 512Mx72 Module(1Rank of x4) - page1154GB, 512Mx72 Module(1Rank of x4) - page2168GB, 1Gx72 Module(4Rank of x8) - page1178GB, 1Gx72 Module(4Rank of x8) - page2188GB, 1Gx72 Module(4Rank of x8) - page3198GB, 1Gx72 Module(2Rank of x4) - page1208GB, 1Gx72 Module(2Rank of x4) - page2218GB, 1Gx72 Module(2Rank of x4) - page32216GB, 2Gx72 Module(4Rank of x4) - page12316GB, 2Gx72 Module(4Rank of x4) - page22416GB, 2Gx72 Module(4Rank of x4) - page32516GB, 2Gx72 Module(4Rank of x4) - page42616GB, 2Gx72 Module(4Rank of x4) - page527Absolute Maximum Ratings28Absolute Maximum DC Ratings28DRAM Component Operating Temperature Range28AC & DC Operating Conditions29Recommended DC Operating Conditions29AC & DC Input Measurement Levels30AC and DC Input Levels for Single-Ended Command and Address Signals30AC and DC Input Levels for Single-Ended Signals31Vref Tolerances32AC and DC Logic Input Levels for Differential Signals33Differential signal definition33Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)34Single-ended requirements for differential signals35Differential Input Cross Point Voltage37Slew Rate Definitions for Single-Ended Input Signals38Slew Rate Definitions for Differential Input Signals38AC & DC Output Measurement Levels39Single Ended AC and DC Output Levels39Differential AC and DC Output Levels39Single Ended Output Slew Rate40Differential Output Slew Rate41Reference Load for AC Timing and Output Slew Rate42Overshoot and Undershoot Specifications43Address and Control Overshoot and Undershoot Specifications43Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications44Refresh parameters by device density45Standard Speed Bins46DDR3-800 Speed Bins46DDR3-1066 Speed Bins47DDR3-1333 Speed Bins48DDR3-1600 Speed Bins49Speed Bin Table Notes50Environmental Parameters51IDD and IDDQ Specification Parameters and Test Conditions52IDD Specifications (Tcase: 0 to 95oC)642GB, 256M x 72 R-DIMM: HMT325R7BFR8C644GB, 512M x 72 R-DIMM: HMT351R7BFR8C644GB, 512M x 72 R-DIMM: HMT351R7BFR4C658GB, 1G x 72 R-DIMM: HMT31GR7BFR8C658GB, 1G x 72 R-DIMM: HMT31GR7BFR4C6616GB, 2G x 72 R-DIMM: HMT42GR7BMR4C66Module Dimensions67256Mx72 - HMT325R7BFR8C67512Mx72 - HMT351R7BFR8C68512Mx72 - HMT351R7BFR4C691Gx72 - HMT31GR7BFR8C701Gx72 - HMT31GR7BFR8C - Heat Spreader711Gx72 - HMT31GR7BFR4C721Gx72 - HMT31GR7BFR4C - Heat Spreader732Gx72 - HMT42GR7BMR4C742Gx72 - HMT42GR7BMR4C - Heat Spreader75Taille: 980 koPages: 75Language: EnglishOuvrir le manuel
Manuel D’Utilisation (HMT31GR7BFR4C-H9)Table des matièresDescription3Features3Ordering Information3Key Parameters4Speed Grade4Address Table4Pin Descriptions5Input/Output Functional Descriptions6Pin Assignments8Registering Clock Driver Specifications10Capacitance Values10Input & Output Timing Requirements10On DIMM Thermal Sensor11Connection of Thermal Sensor11Temperature-to-Digital Conversion Performance11Functional Block Diagram122GB, 256Mx72 Module(1Rank of x8)124GB, 512Mx72 Module(2Rank of x8) - page1134GB, 512Mx72 Module(2Rank of x8) - page2144GB, 512Mx72 Module(1Rank of x4) - page1154GB, 512Mx72 Module(1Rank of x4) - page2168GB, 1Gx72 Module(4Rank of x8) - page1178GB, 1Gx72 Module(4Rank of x8) - page2188GB, 1Gx72 Module(4Rank of x8) - page3198GB, 1Gx72 Module(2Rank of x4) - page1208GB, 1Gx72 Module(2Rank of x4) - page2218GB, 1Gx72 Module(2Rank of x4) - page32216GB, 2Gx72 Module(4Rank of x4) - page12316GB, 2Gx72 Module(4Rank of x4) - page22416GB, 2Gx72 Module(4Rank of x4) - page32516GB, 2Gx72 Module(4Rank of x4) - page42616GB, 2Gx72 Module(4Rank of x4) - page527Absolute Maximum Ratings28Absolute Maximum DC Ratings28DRAM Component Operating Temperature Range28AC & DC Operating Conditions29Recommended DC Operating Conditions29AC & DC Input Measurement Levels30AC and DC Input Levels for Single-Ended Command and Address Signals30AC and DC Input Levels for Single-Ended Signals31Vref Tolerances32AC and DC Logic Input Levels for Differential Signals33Differential signal definition33Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)34Single-ended requirements for differential signals35Differential Input Cross Point Voltage37Slew Rate Definitions for Single-Ended Input Signals38Slew Rate Definitions for Differential Input Signals38AC & DC Output Measurement Levels39Single Ended AC and DC Output Levels39Differential AC and DC Output Levels39Single Ended Output Slew Rate40Differential Output Slew Rate41Reference Load for AC Timing and Output Slew Rate42Overshoot and Undershoot Specifications43Address and Control Overshoot and Undershoot Specifications43Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications44Refresh parameters by device density45Standard Speed Bins46DDR3-800 Speed Bins46DDR3-1066 Speed Bins47DDR3-1333 Speed Bins48DDR3-1600 Speed Bins49Speed Bin Table Notes50Environmental Parameters51IDD and IDDQ Specification Parameters and Test Conditions52IDD Specifications (Tcase: 0 to 95oC)642GB, 256M x 72 R-DIMM: HMT325R7BFR8C644GB, 512M x 72 R-DIMM: HMT351R7BFR8C644GB, 512M x 72 R-DIMM: HMT351R7BFR4C658GB, 1G x 72 R-DIMM: HMT31GR7BFR8C658GB, 1G x 72 R-DIMM: HMT31GR7BFR4C6616GB, 2G x 72 R-DIMM: HMT42GR7BMR4C66Module Dimensions67256Mx72 - HMT325R7BFR8C67512Mx72 - HMT351R7BFR8C68512Mx72 - HMT351R7BFR4C691Gx72 - HMT31GR7BFR8C701Gx72 - HMT31GR7BFR8C - Heat Spreader711Gx72 - HMT31GR7BFR4C721Gx72 - HMT31GR7BFR4C - Heat Spreader732Gx72 - HMT42GR7BMR4C742Gx72 - HMT42GR7BMR4C - Heat Spreader75Taille: 980 koPages: 75Language: EnglishOuvrir le manuel
Manuel D’Utilisation (HMT41GU7MFR8C-H9)Table des matièresDescription3Feature3Ordering Information3Key Parameters4Speed Grade4Address Table4Pin Descriptions5Input/Output Functional Descriptions6Pin Assignments8On DIMM Thermal Sensor10Connection of Thermal Sensor10Temperature-to-Digital Conversion Performance10Functional Block Diagram114GB, 512Mx64 Module(1Rank of x8)118GB, 1Gx64 Module(2Rank of x8)128GB, 1Gx72 Module(2Rank of x8)13Absolute Maximum Ratings14Absolute Maximum DC Ratings14DRAM Component Operating Temperature Range14AC & DC Operating Conditions15Recommended DC Operating Conditions15AC & DC Input Measurement Levels16AC and DC Input Levels for Single-Ended Command and Address Signals16AC and DC Input Levels for Single-Ended Signals17Vref Tolerances18AC and DC Logic Input Levels for Differential Signals19Differential signal definition19Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)20Single-ended requirements for differential signals21Differential Input Cross Point Voltage22Slew Rate Definitions for Single-Ended Input Signals23Slew Rate Definitions for Differential Input Signals24AC & DC Output Measurement Levels25Single Ended AC and DC Output Levels25Differential AC and DC Output Levels25Single Ended Output Slew Rate26Differential Output Slew Rate27Reference Load for AC Timing and Output Slew Rate28Overshoot and Undershoot Specifications29Address and Control Overshoot and Undershoot Specifications29Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications30Refresh parameters by device density31Standard Speed Bins32DDR3-800 Speed Bins32DDR3-1066 Speed Bins33DDR3-1333 Speed Bins34DDR3-1600 Speed Bins35DDR3-1866 Speed Bins36Speed Bin Table Notes37Environmental Parameters38IDD and IDDQ Specification Parameters and Test Conditions39IDD Specifications (Tcase: 0 to 95oC)514GB, 512M x 64 U-DIMM: HMT451U6MFR8C518GB, 1G x 64 U-DIMM: HMT41GU6MFR8C518GB, 1G x 72 U-DIMM: HMT41GU7MFR8C52Module Dimensions53512Mx64 - HMT451U6MFR8C531Gx64 - HMT41GU6MFR8C541Gx72 - HMT41GU7MFR8C55Taille: 1 MoPages: 55Language: EnglishOuvrir le manuel
