Manuels d'utilisation pour Hynix HMT351U6BFR8C-H9N0

Table des matières

• Description

  3
• Feature

  3
• Ordering Information

  3
• Key Parameters

  4
• Speed Grade

  4
• Address Table

  4
• Pin Descriptions

  5
• Input/Output Functional Descriptions

  6
• Pin Assignments

  7
• On DIMM Thermal Sensor

  10
  • Connection of Thermal Sensor

    10
  • Temperature-to-Digital Conversion Performance

    10
• Functional Block Diagram

  11
  • 1GB, 128Mx64 Module(1Rank of x16)

    11
  • 2GB, 256Mx64 Module(1Rank of x8)

    12
  • 2GB, 256Mx72 Module(1Rank of x8)

    13
  • 4GB, 512Mx64 Module(2Rank of x8)

    14
  • 4GB, 512Mx72 Module(2Rank of x8)

    15
• Absolute Maximum Ratings

  16
  • Absolute Maximum DC Ratings

    16
  • DRAM Component Operating Temperature Range

    16
• AC & DC Operating Conditions

  17
  • Recommended DC Operating Conditions

    17
• AC & DC Input Measurement Levels

  17
  • AC and DC Input Levels for Single-Ended Command and Address Signals

    17
  • AC and DC Input Levels for Single-Ended Signals

    18
• Vref Tolerances

  19
• AC and DC Logic Input Levels for Differential Signals

  20
  • Differential signal definition

    20
  • Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)

    21
  • Single-ended requirements for differential signals

    22
  • Differential Input Cross Point Voltage

    23
  • Slew Rate Definitions for Single-Ended Input Signals

    24
  • Slew Rate Definitions for Differential Input Signals

    25
• AC & DC Output Measurement Levels

  26
  • Single Ended AC and DC Output Levels

    26
  • Differential AC and DC Output Levels

    26
  • Single Ended Output Slew Rate

    27
  • Differential Output Slew Rate

    28
  • Reference Load for AC Timing and Output Slew Rate

    29
• Overshoot and Undershoot Specifications

  30
  • Address and Control Overshoot and Undershoot Specifications

    30
  • Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications

    31
• Refresh parameters by device density

  32
• Standard Speed Bins

  33
  • DDR3-800 Speed Bins

    33
  • DDR3-1066 Speed Bins

    34
  • DDR3-1333 Speed Bins

    35
  • DDR3-1600 Speed Bins

    36
  • Speed Bin Table Notes

    37
• Environmental Parameters

  38
• Pin Capacitance (VDD=1.5V, VDDQ=1.5V)

  39
  • 1GB: HMT312U6BFR6C

    39
  • 2GB: HMT325U6BFR8C

    39
  • 2GB: HMT325U7BFR8C

    39
  • 4GB: HMT351U6BFR8C

    39
  • 4GB: HMT351U7BFR8C

    39
• IDD and IDDQ Specification Parameters and Test Conditions

  40
• IDD Specifications (Tcase: 0 to 95oC)

  52
  • 1GB, 128M x 64 U-DIMM: HMT312U6BFR6C

    52
  • 2GB, 256M x 64 U-DIMM: HMT325U6BFR8C

    52
  • 2GB, 256M x 72 U-DIMM: HMT325U7BFR8C

    53
  • 4GB, 512M x 64 U-DIMM: HMT351U6BFR8C

    53
  • 4GB, 512M x 72 U-DIMM: HMT351U7BFR8C

    54
• Module Dimensions

  55
  • 128Mx64 - HMT312U6BFR6C

    55
  • 256Mx64 - HMT325U6BFR8C

    56
  • 256Mx72 - HMT325U7BFR8C

    57
  • 512Mx64 - HMT351U6BFR8C

    58
  • 512Mx72 - HMT351U7BFR8C

    59