Manuels d'utilisation pour IBM P5 570

Table des matières

• Front cover

  1
• Contents

  5
• Notices

  9
  • Trademarks

    10
• Preface

  11
  • The team that wrote this Redpaper

    11
  • Become a published author

    12
  • Comments welcome

    12
• Chapter 1. General description

  13
  • 1.1 System specifications

    15
  • 1.2 Physical package

    15
  • 1.3 Minimum and optional features

    16
    • 1.3.1 Processor card features

      17
    • 1.3.2 Memory features

      18
    • 1.3.3 Disk and media features

      18
    • 1.3.4 USB diskette drive

      19
    • 1.3.5 I/O drawers

      19
    • 1.3.6 Hardware Management Console models

      23
  • 1.4 Value Paks

    23
  • 1.5 Model type conversion

    24
  • 1.6 System racks

    24
    • 1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack

      25
    • 1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack

      26
    • 1.6.3 AC Power Distribution Unit and rack content

      26
    • 1.6.4 Rack-mounting rules for p5-570 and I/O drawers

      26
    • 1.6.5 Additional options for rack

      27
    • 1.6.6 OEM rack

      28
  • 1.7 Statement of direction

    29
• Chapter 2. Architecture and technical overview

  31
  • 2.1 The POWER5 chip

    32
    • 2.1.1 Simultaneous multi-threading

      33
    • 2.1.2 Dynamic power management

      33
    • 2.1.3 The POWER chip evolution

      34
    • 2.1.4 CMOS, copper, and SOI technology

      35
  • 2.2 Processor cards

    35
    • 2.2.1 Processor drawer interconnect cables

      36
    • 2.2.2 Processor clock rate

      37
  • 2.3 Memory subsystem

    38
    • 2.3.1 Memory placement rules

      38
    • 2.3.2 Memory restriction

      38
    • 2.3.3 Memory throughput

      39
  • 2.4 System buses

    39
    • 2.4.1 RIO-2 buses and GX+ card

      39
    • 2.4.2 SP bus

      40
  • 2.5 Internal I/O subsystem

    40
    • 2.5.1 PCI-X slots and adapters

      40
    • 2.5.2 LAN adapters

      41
    • 2.5.3 Graphic accelerators

      41
    • 2.5.4 SCSI adapters

      41
  • 2.6 Internal storage

    42
    • 2.6.1 Internal hot swappable SCSI disks

      42
    • 2.6.2 Internal RAID options

      43
    • 2.6.3 Internal media devices

      43
  • 2.7 External I/O subsystems

    44
    • 2.7.1 I/O drawers

      44
    • 2.7.2 7311 Model D10 and 7311 Model D11 I/O drawers

      44
    • 2.7.3 7311 Model D20 I/O drawer

      45
    • 2.7.4 7311 I/O drawer and RIO-2 cabling

      46
    • 2.7.5 7311 I/O drawer and SPCN cabling

      47
    • 2.7.6 External disk subsystems

      48
  • 2.8 Dynamic logical partitioning

    50
  • 2.9 Virtualization

    50
    • 2.9.1 Virtual Ethernet

      50
    • 2.9.2 Advanced POWER Virtualization feature

      50
  • 2.10 Service processor

    53
    • 2.10.1 Service processor - base

      54
    • 2.10.2 Service processor - extender

      54
  • 2.11 Boot process

    55
    • 2.11.1 IPL flow without an HMC attached to the system

      55
    • 2.11.2 Hardware Management Console

      56
    • 2.11.3 IPL flow with an HMC attached to the system

      56
    • 2.11.4 Definitions of partitions

      57
    • 2.11.5 Hardware requirements for partitioning

      58
    • 2.11.6 Specific partition definitions used for Micro-Partitioning

      58
    • 2.11.7 System Management Services

      58
    • 2.11.8 Boot options

      59
    • 2.11.9 Additional boot options

      60
    • 2.11.10 Security

      61
  • 2.12 Operating system requirements

    61
    • 2.12.1 AIX 5L

      61
    • 2.12.2 Linux

      62
• Chapter 3. Capacity on Demand, RAS, and manageability

  63
  • 3.1 Capacity on Demand

    64
    • 3.1.1 Processor Capacity Upgrade on Demand methods

      64
    • 3.1.2 Capacity Upgrade on Demand for memory

      65
    • 3.1.3 How to report temporary activation resources

      66
    • 3.1.4 Trial Capacity on Demand

      67
  • 3.2 Reliability, availability, and serviceability

    67
    • 3.2.1 Fault avoidance

      67
    • 3.2.2 First Failure Data Capture

      68
    • 3.2.3 Permanent monitoring

      68
    • 3.2.4 Self-healing

      69
    • 3.2.5 N+1 redundancy

      70
    • 3.2.6 Fault masking

      70
    • 3.2.7 Resource deallocation

      70
    • 3.2.8 Serviceability

      71
  • 3.3 Manageability

    72
    • 3.3.1 Advanced System Management Interface

      72
    • 3.3.2 Service Agent

      73
    • 3.3.3 p5 Customer-Managed Microcode

      74
    • 3.3.4 Service Update Management Assistant

      74
  • 3.4 Cluster 1600

    75
• Related publications

  77
  • IBM Redbooks

    77
  • Other publications

    77
  • Online resources

    78
  • How to get IBM Redbooks

    79
  • Help from IBM

    79
• Back cover

  82