Manuel D’Utilisation (AW80577GG0452MA)Table des matièresIntel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Intel® Core™2 Extreme Mobile Processor on 45-nm Process1Revision History61 Introduction71.1 Terminology81.2 References92 Low Power Features112.1 Clock Control and Low-Power States112.1.1 Core Low-Power State Descriptions132.1.2 Package Low-power State Descriptions152.2 Enhanced Intel SpeedStep® Technology192.3 Extended Low-Power States202.4 FSB Low Power Enhancements212.4.1 Dynamic FSB Frequency Switching212.4.2 Enhanced Intel® Dynamic Acceleration Technology222.5 VID-x232.6 Processor Power Status Indicator (PSI-2) Signal233 Electrical Specifications253.1 Power and Ground Pins253.2 Decoupling Guidelines253.2.1 VCC Decoupling253.2.2 FSB AGTL+ Decoupling253.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking253.3 Voltage Identification and Power Sequencing263.4 Catastrophic Thermal Protection293.5 Reserved and Unused Pins293.6 FSB Frequency Select Signals (BSEL[2:0])293.7 FSB Signal Groups303.8 CMOS Signals313.9 Maximum Ratings313.10 Processor DC Specifications324 Package Mechanical Specifications and Pin Information514.1 Package Mechanical Specifications514.2 Processor Pinout and Pin List594.3 Alphabetical Signals Reference935 Thermal Specifications and Design Considerations1015.1 Monitoring Die Temperature1085.1.1 Thermal Diode1085.1.2 Intel® Thermal Monitor1095.1.3 Digital Thermal Sensor1115.2 Out of Specification Detection1125.3 PROCHOT# Signal Pin112Taille: 2,1 MoPages: 113Language: EnglishOuvrir le manuel
Manuel D’Utilisation (AW80577GG0452ML)Table des matièresIntel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Intel® Core™2 Extreme Mobile Processor on 45-nm Process1Revision History61 Introduction71.1 Terminology81.2 References92 Low Power Features112.1 Clock Control and Low-Power States112.1.1 Core Low-Power State Descriptions132.1.2 Package Low-power State Descriptions152.2 Enhanced Intel SpeedStep® Technology192.3 Extended Low-Power States202.4 FSB Low Power Enhancements212.4.1 Dynamic FSB Frequency Switching212.4.2 Enhanced Intel® Dynamic Acceleration Technology222.5 VID-x232.6 Processor Power Status Indicator (PSI-2) Signal233 Electrical Specifications253.1 Power and Ground Pins253.2 Decoupling Guidelines253.2.1 VCC Decoupling253.2.2 FSB AGTL+ Decoupling253.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking253.3 Voltage Identification and Power Sequencing263.4 Catastrophic Thermal Protection293.5 Reserved and Unused Pins293.6 FSB Frequency Select Signals (BSEL[2:0])293.7 FSB Signal Groups303.8 CMOS Signals313.9 Maximum Ratings313.10 Processor DC Specifications324 Package Mechanical Specifications and Pin Information514.1 Package Mechanical Specifications514.2 Processor Pinout and Pin List594.3 Alphabetical Signals Reference935 Thermal Specifications and Design Considerations1015.1 Monitoring Die Temperature1085.1.1 Thermal Diode1085.1.2 Intel® Thermal Monitor1095.1.3 Digital Thermal Sensor1115.2 Out of Specification Detection1125.3 PROCHOT# Signal Pin112Taille: 2,1 MoPages: 113Language: EnglishOuvrir le manuel
